Electronics Forum | Tue Jan 07 15:03:25 EST 2003 | ksfacinelli
I have a client interested in using a Toshiba Part P-TFBGA48-0607-0-0.75AZ. Mechanical data on the part can be found at: http://www.toshiba.com/taec/components/Datasheet/51WHM516AXBN.pdf I am concerned with being able to use this part with consist
Electronics Forum | Mon Feb 03 11:17:55 EST 2003 | Randy Villeneuve
White residues are a common problem when cleaning no-clean fluxe residues. The white residue forms when the flux residue is partialy removed, etc. Alcohol should not be your only solution for cleaning. In general, solvents may attack some plastic par
Electronics Forum | Mon Feb 03 05:02:49 EST 2003 | Eugene
Hi all. One of our customers recently asked us during an audit of our PCBA rework line if we have a limit for the total number of reworks/repairs that can be done on one PCBA. We specify 3x maximum on one location of a major part (LSI for example). B
Electronics Forum | Mon Feb 03 12:52:42 EST 2003 | MA/NY DDave
Hi I won't give you an answer directly yet I hope the following makes sense. The max rework depends on what is used in the reliability model and/or experimental data as worst case for the applications end of life reliability needs. E.G. let's say
Electronics Forum | Mon Feb 03 18:00:49 EST 2003 | slthomas
I know that the accepted (by some, although some say it may be too conservative) rule is anything less than or equal to 30 grams/square inch of surface contact area should stay on the bottom side during the second pass. How is that surface area meas
Electronics Forum | Mon Feb 03 20:23:48 EST 2003 | davef
Use the pad mating to lead wetting area. Check: * Phil Zarrow's site [ http://www.itmconsulting.org ] for a paper. * Bob Willis may have something on his site [ http://www.bobwillis.co.uk ]. He has been very involved in developing this measure. * F
Electronics Forum | Mon Feb 03 23:49:00 EST 2003 | Dreamsniper
Hi, Has anyone who's using vapor phase process able to help me troubleshoot tombstoning? I raed about uneven forces during reflow due to misalignment, pad design, paste volume deposition unevenness due to dirty stencils, worn stencil printer parts s
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Mon Feb 10 21:42:03 EST 2003 | MA/NY DDave
Hey Nice Write Up, Running after his message Apex out in CA is coming in ??March (I'm to lazy to go and get the brochure) (Yet you can do a web hit on it Nepcon East in Boston is coming in June And there are other shows where you can see all t
Electronics Forum | Thu Mar 27 14:09:41 EST 2003 | Enrique Chairez
Hi All, I have observed this problem with one PCB supplier, the portion of the PCB area affected was cut and observed in SEM (Scanning Electron Microscope) and submitted to an EDX (Energy Disperse X ray analysis), finding Phosphorus levels higher
