Electronics Forum | Tue Mar 15 09:34:31 EST 2005 | Sandy Kelley
I have been engaged to find an Applications Engineer for an electronic materials division of a worldwide multi-billion dollar diversified international specialty chemical endeavor. My client is a well respected, cutting edge technology leader in un
Electronics Forum | Thu Dec 09 04:21:22 EST 2004 | chad
I have worked w/ the GSI SVS 8200's. They seem to do a pretty decent job, but, they are a "bottleneck" on my lines. I hope you are using good screen printers, because they WILL find the slightest "defect". About 75% of our failures are actually fa
Electronics Forum | Thu Dec 09 14:26:22 EST 2004 | Steve Gregory
Hi All! We've transferred our Electrovert MCS-1000 cleaner down to our Stafford, Texas facility, and I was wondering if any of you know of a referral I could give to them of any service organization that could work on the machine is if the need ever
Electronics Forum | Thu Dec 09 15:19:21 EST 2004 | nrocco
Can anyone point me in the direction to find some IPC standards for lead free solder joint reliablity tests, such as shear tests, pull tests, vibe tests, enviroment tests, etc. I need to know what the specs. are on all aspects of reliability and how
Electronics Forum | Thu Dec 16 09:59:47 EST 2004 | saragorcos
Hi there - unfortunately, there are no good cleanliness specs available mainly because clealiness requirements are case sensitive - you should talk to Terry Munson at 765-457-8095 - he can definitely give you advice on Ion Chromatography, SIR, ROSE t
Electronics Forum | Sun Jan 09 19:37:15 EST 2005 | Bob R.
I'm just thinking out loud here with no experience to back it up, but I could see where you're trapping air or solvent filled voids inside the via by tenting from both sides. When you go through a heat cycle like reflow or wave solder you could be e
Electronics Forum | Wed Dec 22 19:09:17 EST 2004 | rohman23
Very strange...I just logged into the internet to come post this very question for all the lurking experts. We have a 16 layer rigid-flex that we have never baked. Our board vendor is expressing concern that we do not perform a pre-bake before assy
Electronics Forum | Tue Dec 28 09:21:22 EST 2004 | pjc
In almost every application an ultrasonic spray fluxer will out perform foam fluxing. Better soldering results are what most expereince after making the change to U/S spray. There are good ultrasonic units from USI and Sono-Tek. www.ultraspray.com w
Electronics Forum | Fri Jan 07 09:56:04 EST 2005 | davef
Electroformed stencil suppliers follow. The describe the stencil production process on their sites. * Aplpha Metals [ http://www.alphametals.com/products/ stencils/pdf/PG_Electroform_Stencils.pdf ] * Chepaume [ http://www.chepaume.com/electroforming
Electronics Forum | Wed Jan 12 09:19:06 EST 2005 | Scott B
If you go into 'Magazine' menu and select 'Hydra preparation' then select the layout you wish to optimise (thats the stinger, you can only optimise for a single layout). You will then be presented with optimisation options which can be adjusted ('sa
