Electronics Forum | Tue May 07 08:04:17 EDT 2002 | Sir Alexandr
Sorry if info is useless, but placement machines must have own system programs for completly ajustment of placement in a gap about 0.01 mm . Also headblock camera has enought increment to found correct place and fiducial setups utility. Maybe your lo
Electronics Forum | Fri Jun 20 12:44:18 EDT 2003 | sasha
We had this problem with 0805 0.1 mF also. This problem was only with this capacitor. We have replaced all these capacitor after the ninth occurrence. My opinion - it is a defect of the manufacturer. Please inform the manufacturer of your capacitor.
Electronics Forum | Thu Dec 16 13:10:30 EST 2004 | chics
100 Centipoise = 1 Poise 1 Centipoise = 1 mPa s (Millipascal Second) 1 Poise = 0.1 Pa s (Pascal Second) Centipoise = Centistoke x Density
Electronics Forum | Tue Jun 07 20:19:31 EDT 2005 | davef
That depends a great deal on what you are cleaning and how clean do you want to get the substrate. We've seen cases where 0.1 uS-cm was insufficiently good and others where 10 uS-cm was more than sufficient.
Electronics Forum | Tue Oct 28 12:02:11 EDT 2008 | milas
Hi We have recently specified the following on a bareboard that has an ENIG finish. Does it sound about right or is it likely to give me problems ? Nickel : 3uM � 7uM Gold : 0.05 uM � 0.1 uM Thanks in advance
Electronics Forum | Wed Apr 07 03:44:40 EDT 2010 | jackevest
The missing rate spec. of normal machine is under 0.3%, for our experience 0.1% is normal for average, if you can maintain the machine well, like the nozzle cleaning, feeder maitain...you can keep the 0.05%.
Electronics Forum | Thu Aug 26 03:58:32 EDT 2010 | jacki
Hi all Did anyone encounter that the thermal crack failure or any failure issue by using the Kemet Ceramic Cap, particularly 0.1uF,while wave soldering? Before using this part, I want to clarify whether it is suitable for our process or not. Thanks i
Electronics Forum | Thu Sep 02 20:39:39 EDT 2010 | Jacki
Hi davf Our process is the manufacturing burn-in-bord, SMT,insert sockets, wave and touch up. 1 board needs 0.1UF about 3k+ components.Kemet recommanded to use the reflow machine for Ceramic Cap when i chked its website.
Electronics Forum | Tue Jun 26 15:40:12 EDT 2012 | ssupertuba
Hello there, I'm presently experiencing some blow holes and solder voids in the solder fillet of caps on boards. They are ceramic caps. The solder is SAC105 and the parts range from 33pf to 0.1uf ceramic. Any suggestions?
Electronics Forum | Sun Mar 25 08:49:49 EDT 2018 | jacobidiego
Hi experts, Is it normal that a stencil of 0,1mm would produce 45% solder paste volume being printed over the board? Or is a property linked to the solder paste? thanks in advance
