Electronics Forum | Tue Jan 06 08:05:33 EST 2004 | stefwitt
The manual is a bit more specific: Connections and Energy Requirements Specification for the Compressed Air For the compressed air supplied for the automatic placement systems HS-180 (adhesive application station as well as placement station) and SP
Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
Electronics Forum | Wed Jun 11 10:24:23 EDT 2003 | kris
Hi, The percentage of lead (0.1% or otherwise) is still being debated in the EU where the legislation is in place. The industry is pushing for a 0.2% limit,(if lead-free has to be) as it is considered a limit where solder can be recycled economical
Electronics Forum | Wed Oct 25 12:14:35 EDT 2006 | GS
Yes SWAG you are right, heat could be dangerous for the parts to be removed. Any way it is not so easy to remove epoxy adhesive (3609) once it is cured. By heating the adhesive (over his TG temperature)it gets softened and by using a mec
Electronics Forum | Mon Sep 03 10:50:47 EDT 2007 | kissanepat1
A suggestion for your stencil which works is as follows. Cut your stencil aperatures beyond your pads to a length of 0.1mm , this then allows the paste to pull back into the pad creating a blob of solder which can be inspected by AOI.Best length and
Electronics Forum | Thu Aug 21 18:10:06 EDT 2008 | osp2008
Hi, Have you been able to find nate source of wave soldering fingers?I have just started this company and we carry technical devices wave solder finger. Each made of 100% pure titanium and 0.1mm thicker. If you need to try one out of my products .
Electronics Forum | Thu Dec 04 10:26:06 EST 2008 | billmeye
Is anyone aware of any white papers regarding the possibility of lead contamination on ROHS assemblies from using the same test fixture with the same test probes on both tin/lead and ROHS assemblies. We have customers switching over but we are still
Electronics Forum | Fri Apr 10 13:25:08 EDT 2009 | jefflkupkt
Layer 2 is the ground plane layer of a 4 layer board. After installing a 2.5 mm DC power jack and 0.1 center SIP header by hand, the ground pin disconnects and causes an open. My board supplier said they passed Electrical Test. Prepreg was within
Electronics Forum | Sat Jun 06 15:14:35 EDT 2009 | ysutariya
If the concern is the increased moisture absorption associated with lead-free capable materials, you probably have the most experience with phenolic materials like Isola IS410 or 370HR. The best move would be to switch to an IPC 4101/99 or /124 mate
Electronics Forum | Thu Sep 06 15:41:23 EDT 2012 | rway
This appears to be a non-standard marking. Where did you find this? What is is out of? The 84 may be related to the cap value. Have you tried to measure it? I'm not sure about the "EG" part of it. This marking may be mfg specific, but the stand
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