Electronics Forum | Thu Jul 16 10:40:12 EDT 2015 | migliore
Hi, Question 1: can anyone explain me what the VIA ASPECT RATIO is? Question 2: Let's say that a PCB manufacturer specifies a VIA ASPECT RATIO of 8:1. Can I have vias of drill diameter of 0.1 mm on a 2L board 1.6 thick? thanks, Enrico Migliore
Electronics Forum | Tue Dec 27 06:52:34 EST 2016 | luciano
Thanks for your advice. I've tried setting the temperature up and even measuring the temperature at the wave itself but had no luck at all. I've also tried using temperatures going from 245 ºC up to 260 ºC. The amount of flux was adjusted as well a
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Wed Jan 19 22:28:20 EST 2000 | Dave F
Taking things from a slightly different angle: Cost of assembling various packages based on volume: C/R placement: |$0.01 to 0.04 per part SOIC: | $0.03 PLCC based on lead count: | 20-39 $0.16 | 40-59 $0.18 | 60-79 $0.20 | 80-
Electronics Forum | Fri Sep 08 01:08:10 EDT 2017 | tsvetan
The material is 0.12mm stainless steel, electropolished it's thick for fine pitch but we have lot of other big components on the board which do not solder good if we use 0.1mm thickness stencil. The 0.3 mm apretures are big enough and have good rele
Electronics Forum | Mon Mar 25 15:51:04 EST 2002 | davef
ASQC re-numbered the once free (taxpayer sponsored development) MIL-STD-105 as ASQ-Z1.4, slapped their own cover on it, and now charge $40 or $50 for the same document! The standards are identical, so see if you can get one of the old �MIL-STD's� and
Electronics Forum | Wed May 02 04:04:18 EDT 2007 | greg york
What aload of rubbish - prove it, we have over 320 users in the UK alone using the SACP0307 solder with great results, and the biggest advantage they have is they can multiple source the solder not stuck to one company who has purchased the patent an
Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
Electronics Forum | Thu Nov 09 13:26:08 EST 2000 | omar_verdugo
Somebody can help me with this problem.I already have installed the version of fujicam 1.2 but the machine interface that come with this don't work propertly this have a little problem with the rotation of theta is not the same with the theta assingn
Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech
Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch
