Electronics Forum | Wed Sep 01 14:07:41 EDT 1999 | Dave F
| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea
Electronics Forum | Mon Mar 24 20:30:01 EDT 2014 | davef
The "correct" answer is: Use the tests and methods that you used to qualify your solder paste in the first place. That sounds good but might not be all that practical for practicing assembly-types. Here's something that's not as good, but will give
Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Fri Apr 02 16:45:29 EST 2004 | cedams
Ken, You'd think so but the tooling pins only register to the drilling process for the PCB. The fiducial registers to the copper pattern and for both glueing and placing SMT components the pads are more important than the holes. That's why the machi
Electronics Forum | Thu Apr 21 17:46:17 EDT 2005 | Frank
Russ, Your math is right, but you are converting the wrong direction. I belive: 0201s use millimeters for specification sizes, not inches. And 01005 use millimeters for specification sizes, not inches. And it may be like that for all passives, bu
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Fri Aug 07 07:55:30 EDT 2009 | robhs
Hi. We are planning a production run of a board that utilises the SEMTECH SLP2710P8 8-pin device (2.7 x 1.0 x 0.58mm). The part orientation on the board necessitates that the squeegee print direction approaches the stencil apertures on the long side
Electronics Forum | Mon Sep 21 22:25:05 EDT 2009 | davef
What babies!!!! Sure, give it a try. * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, a
Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef
Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print
