Electronics Forum: .3 mm bga (Page 5 of 178)

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Wed Sep 15 07:29:23 EDT 2004 | kbayram

Thank you Rob for all the help, it has cleared up a lot of things. The smtsales site looks good too, I'ill definitely be giving them a call when the time comes. Thanks again.

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Thu Sep 09 13:25:11 EDT 2004 | kbayram

Thank you all for your replies. Coincidently I am in the UK and doing research for a purchase in the first half of next year for export. At that price range what year of manufacture are we looking at? Looking at the specs it looks like a good, w

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Tue Sep 14 04:42:58 EDT 2004 | rlackey

Hello again Mr Bayram, You will need to do certain tasks to schedule - things like lubrication etc, but these are very simple tasks. But yes, if you are running a lot slower then the major service tasks will be less frequent. One thing I ought t

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Fri Sep 10 12:34:40 EDT 2004 | kbayram

Thanks again for your insights. I'm just learning the details of these machines so you'ill have to bear with me. The descision will be made in around 6 months so I thought I would start my research sooner rather than later. I did get the impression

Re: pcb design for bga grounding.

Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn

| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground

Re: pcb design for bga grounding.

Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare

| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the

Layer Stack for 6L PCB with 0.8 mm thickness

Electronics Forum | Tue Feb 16 14:04:10 EST 2016 | tsvetan

We are designing board which have to plug in M.2 connector and thickness is limited to 0.8 mm The board is very complex with many BGAs and DDR3 memory chips and we will need 6 layers for routing. The problem is that we will need signals with 50, 90

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla

I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.

Does anyone know of a 0.3mm pitch BGA or WL-CSP or anything with a 0.3mm pitch?

Electronics Forum | Mon Nov 16 20:22:52 EST 2015 | billthebuilder

I need one for testing a PnP machine. It's very hard to hunt something down just by package, so does anyone know of anything with a 0.3mm pitch? BGA preferred. Or clues where to look? Thanks!


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