Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef
BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Fri May 04 11:42:48 EDT 2012 | scottjwarren
Greetings! I run a small CM company in the Midwest. We built our business on THT production for the boutique music products industry and are currently planning our launch of a low-volume/high-mix SMT line to support the growth of our business. Our
Electronics Forum | Sun Jul 28 16:11:40 EDT 2013 | jfs
Greetings! I run a small CM company in the > Midwest. We built our business on THT production > for the boutique music products industry and are > currently planning our launch of a > low-volume/high-mix SMT line to support the > growth of our
Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2
Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa
Electronics Forum | Wed Feb 24 12:53:55 EST 1999 | Dave F
| Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. | | Steve | Steve: �BGA�: Micro BGA�. A brand name for a fine pitch BGA from Tessera. Fine Pitch (1) In SMD: Surfa
Electronics Forum | Wed Feb 22 08:02:56 EST 2006 | dj44
I was looking for an stencil design for a 0.5mm pitch uBGA. Pad size is 0.38mm in diameter. We have been using 5mil stencil with type 3 no clean paste. What size aperture should we be using? Any suggestions?
Electronics Forum | Fri Nov 30 00:51:10 EST 2007 | vinitverma
Here are the differences (Eclipse vs Eclipse II) Optimum Speed: 5000 vs 6500cph Feeder Positions (8mm) : 80 vs 94 PCB Loading Time : 4s vs 5.3s PCB Thickness : 0.6-3mm vs 0.5-4mm Max Component Size : 32mm vs 45mm (optional camera possible on Eclipse
Electronics Forum | Fri Nov 04 22:16:56 EST 2005 | mika
I forgot to mention something about the local fiducial marks: In the "old days" where board stretch was a factor to count with; the use of local fid's around a fine pitch component was sometimes necessary; not to forget that the pick & place machines
