Electronics Forum | Fri Feb 20 13:25:00 EST 2004 | russ
Help! i just rec'd my next job from our marketing people and it has a .5mm pitch BGA 8mmX8mm size. Along with this kit came the stencil. So, I have never placed this fine of a BGA before and I am pretty worried about the stencil releasing the past
Electronics Forum | Thu Sep 07 07:36:57 EDT 2017 | tsvetan
we use 0.12 mm stencil with 0.3 mm apretures for 0.5mm step FBGA153 memory without problems the solder paste is SAC305 Class4 http://www.olimex.com/Products/Components/Soldering/SOLDER-PASTE-SAC305-CLASS4/
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Wed Mar 13 09:08:40 EST 2002 | stockley
It is a little bit sad that I know this - be prepared for some confusision - this is not as simple as it might seem. Something tells me that the calculation of the tolerances for the nominal dimensions is a little inconsistent. As I recall the defa
Electronics Forum | Fri Jun 09 17:09:23 EDT 2000 | JAX
Khalid, Just from experiance the actual would be 0.4mm but the inspection size would be 0.3mm. This should not matter since you should be able to pull up the spec sheets on any part you place.( All you need is the Vendor and the manufacting part numb
Electronics Forum | Thu May 18 23:22:44 EDT 2000 | Micah Newcomb
Jerry, Contact FujiAmerica and ask for their newest product Guide. Some differences are..... IP2 - SMD1 vision (back lighting only, coplanarity check optional) IP3 - SMD3 vision (back, front, coplanarity check optional) IP3 - BGA transport, I
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Fri Jun 18 11:31:17 EDT 2004 | gregp
I think it depends on the thickness of the PORON sheet. For .3mm balls you could probably get away with a pretty thin sheet (maybe 1/16"). I don't know how thin it comes offhand. For the part you are describing I woulf try maybe a 3.5mm OD and a 1
Electronics Forum | Fri Sep 08 01:08:10 EDT 2017 | tsvetan
The material is 0.12mm stainless steel, electropolished it's thick for fine pitch but we have lot of other big components on the board which do not solder good if we use 0.1mm thickness stencil. The 0.3 mm apretures are big enough and have good rele
