Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Mon Aug 13 09:20:46 EDT 2018 | sara_pcb
What is the difference between jet printing & jet dispensing. Our's is small prototyping, high reliability PCB assembly business. The SMT components used are up to 0.4 mm pitch BGA & 0201 size chips. Which is more suitable for us?
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
Electronics Forum | Tue Mar 05 22:35:49 EST 2002 | Nell
Hi Pete and Dave, I already check with Practical component, Tessera and TopLine Dummy component they said they only have up to 0.5mm pitch CSP. Anyway, thanks for your input... Do both of you know in the market right now is there any 0.4mm pitch C
Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp
I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us
Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon
Maybe something like this could work?
Electronics Forum | Mon Jun 02 09:38:12 EDT 2003 | pjc
yo Evt, ".., what's the difference?". Answer: Huuuge!! between running 0.4mm pitch QFP and a BGA of same I/O, in terms of handling, storage, feeding (trays), p&p, inspection, test, rework, etc.......
Electronics Forum | Fri Nov 19 10:23:07 EST 2010 | adetuc
Hi, Does anyone know what the placement success percentage is for lead components And the placement success percentage for lead free BGA components. We place many varieties of BGA devices, over 100 different size parts, from 1000 pin BGA to small 4mm
Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty
Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself
