Electronics Forum | Wed Aug 31 00:50:59 EDT 2005 | grantp
Hi, We have a new part we need to mount, and it's a .5 mm pitch BGA with .3 mm diameter pads. That's a lot smaller than we have done before, and we currently use 1 mm pitch BGA's with .5 pads. Has anyone does .5 mm pitch BGA's and what needs to be
Electronics Forum | Wed Aug 31 02:12:20 EDT 2005 | siverts
BGA's with pitch
Electronics Forum | Fri Jul 09 18:27:43 EDT 1999 | Scott Cook
Jim, GREAT to see you post and contribute. Nice to see the forum attracts experts in their field. 'Twas good seeing you at West again, bud. Scott Cook
Electronics Forum | Wed Aug 31 10:50:50 EDT 2005 | aj
Grant, We run the exact same process as you described. 5 thou stencil, 1:1 ratio aj
Electronics Forum | Thu Sep 01 14:30:06 EDT 2005 | lsmith
I have recently tried electroform (100% nickel) stencils. Expensive but awesome paste release. 5 mil foil 10 - 15% aperture reduction for gasketing
Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH
Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems
Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton
We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st
Electronics Forum | Fri Jul 09 17:50:20 EDT 1999 | Jim Blankenhorn
Hi Carol- What you are asking for can be done. Variables you must account for include the paste viscosity, dispensing head speed, dispenser height relative to board surface, and needle size. You can use most any semi-automated system such as Camalo
Electronics Forum | Fri Jul 09 19:35:05 EDT 1999 | Earl Moon
| Hi Carol- | What you are asking for can be done. Variables you must account for include the paste viscosity, dispensing head speed, dispenser height relative to board surface, and needle size. You can use most any semi-automated system such as Ca
Electronics Forum | Mon Feb 23 16:36:21 EST 2004 | www.smtinfo.net
Alpha Metals sells a paste developed especially for 0201's and 0.5 mm pitch BGA's. I have no idea if if does what it promises, but it might be worth to give it a try. See http://www.alphametals.com/omnixsolder/pdfs/OM_6106.PDF
