Electronics Forum | Fri Sep 11 16:52:00 EDT 1998 | Dave F
0.050" -> 50 mil -> 50 pitch 0.80 mm -> 0.032" -> 32 mil -> 32 pitch 0.64 mm -> 0.025" -> 25 mil -> 25 pitch 0.50 mm -> 0.020" -> 20 mil -> 20 pitch 0.40 mm -> 0.016" -> 16 mil -> 16 pitch 0.20 mm -> 0.012" -> 12 mil -> 12 pitch Dave F
Electronics Forum | Tue Jul 06 15:06:35 EDT 1999 | Mike Demos
Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. This
Electronics Forum | Fri Feb 13 17:55:49 EST 2004 | Dale Freeman
I populate several thin panels (0.032")using a Samsung S-2000 P-N-P machine. With panel sizes of 8" by 10", it is very difficult to clamp the panels into the machine with deflection and bowing. Also, the Samsung makes it very difficult to adjust the
Electronics Forum | Tue Mar 22 12:04:31 EST 2005 | John S
Thanks for the advice. In this scenario we are designing our own product. Currently we are building at a prototype level with no appreciable wait between reflow passes. The part in question is a 64 pin QFP. We use a BTU VIP 98 with edge conveyor.
Electronics Forum | Fri Nov 30 22:59:34 EST 2007 | bvdb
Hi Paul, It may not be the perfect replacement for a proper fiducial but I have had some success using thru-holes for fiducials. The tightest pitch part we place is 0.8mm however 0.032"). If the thru-holes are drilled accurately and you are able t
Electronics Forum | Sat May 09 11:46:43 EDT 1998 | Bob Willis
The first thing is all the TSOP suppliers like Intel do not rate the parts at normal temperature used in wave soldering. The spec is less than 230C so you have the reliability issue to consider and no one to blame when they do not work. You also have
Electronics Forum | Mon Sep 17 14:57:11 EDT 2001 | ert002
We are printing 0.012" apertures on a .012" Solder mask defined pad in a fine pitch BGA application. The board is 0.032" thick with very little room on the bottom to place support pins under these areas. Our first pilot proved extremely difficult to
Electronics Forum | Sat Feb 14 12:25:37 EST 2004 | I ramos
I populate several thin panels (0.032")using a > Samsung S-2000 P-N-P machine. With panel sizes > of 8" by 10", it is very difficult to clamp the > panels into the machine with deflection and > bowing. Also, the Samsung makes it very difficult
Electronics Forum | Thu Jul 19 18:15:15 EDT 2012 | jil2000
We have a material that is been stick at cover tape, only 1 supplier is failing and only embossed tape packing is failing. A dark spots between tape and component are observed, we already bake material to se if is humidity, is not. We already apply
Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F
0.050" -> 50 mil -> 50 pitch | 0.80 mm -> 0.032" -> 32 mil -> 32 pitch | 0.64 mm -> 0.025" -> 25 mil -> 25 pitch | 0.50 mm -> 0.020" -> 20 mil -> 20 pitch | 0.40 mm -> 0.016" -> 16 mil -> 16 pitch | 0.20 mm -> 0.012" -> 12 mil -> 12 pitch | Dave F Y
