Electronics Forum | Mon Nov 15 15:31:54 EST 2004 | GP
We are looking for machine that can do the following: bonding of 0.5x0.5x0.8mm mm cramic part. - detect target surface position 1.5x0.8mm - dispance a drop of 0.8mm of epoxy adhesive on trget surface with position accuracy of +/-0.04mm. - pick the 0.
Electronics Forum | Tue Apr 19 09:06:51 EDT 2005 | russ
1005 breaks down like this in mm. the "10" equals 1.0 mm, the "05" equals 0.5mm so, 1005. in inch conversion 1.0mm = .04", 0.5mm = .02" so 0402 (.04" x.02" = 1.0 x 0.5). Hope this helped.
Electronics Forum | Mon Mar 26 10:40:14 EDT 2007 | solderiron
WaveroomPlus can offer the following Sn95.5 Ag3 Cu0.7 Sn95.5 Ag4 Cu0.5 Sn96.5 Ag3.0 Cu0.5 Sn97 Ag2.5 Cu0.5 Steve@waveroomplus.com
Electronics Forum | Mon Jan 29 14:10:19 EST 2007 | tonang
We use M/C printer Samsung SP400V with M/C setting : - Auto Cleaning time 15 ea - SQG down lenght (mm); Front 0.5 Rear 0.5 - SQG Presure Front 0.5 KG, Rear 0.5 Kg - Print speed Front 30 mm/sec, rear 30 mm/sec M/C reflow Heller 1707 EXL, with setting
Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark
Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to
Electronics Forum | Mon Feb 04 12:28:28 EST 2008 | jseagle
1.0mm (0.039") 1.75X >0.5 to 1.0mm (0.02 to 0.039") 4X 0.25 to 0.5mm (0.00984 to 0.02") 10X
Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI
What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.
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