Electronics Forum | Thu Jan 29 05:13:35 EST 2015 | neeraj_iiser
how to solder manganin 0.05mm manganin wire to a copper plate
Electronics Forum | Wed Dec 05 17:44:25 EST 2001 | LloydG
we are in the process of design, plan to use a 0.5 mm pitch BGA. does someone has a recommended footprints. thx!
Electronics Forum | Sun Mar 01 17:54:26 EST 1998 | Mike Mihld
Can anyone advise a good starting point for a temp profile for on 0.05" and 1206 component boards? These boards are simple by todays standards and do not contain any fine pitch or other special components. Thanks in advance... MM
Electronics Forum | Mon Oct 31 01:52:44 EST 2005 | milroyperera
Hi, I`m having some troubles with reflow soldering RQFP-208 pin IC with 0.5mm pitch. The profile is done according the solder paste supplier specs but still this RQFP is shifting in the reflow process. What could be the cause of this and what would
Electronics Forum | Fri Apr 29 14:24:25 EDT 2011 | ppcbs
I am looking for immediate stock of a high temp lead free solder ball. 0.60 mm dia. and an Alloy of 95.5% Sn 4.0% Ag 0.5% Cu Any suggestions.
Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks
5 or 6 mil thicjk stencil and no reduction.
Electronics Forum | Fri Dec 28 17:02:04 EST 2007 | davef
We agree with Chunks
Electronics Forum | Wed May 15 08:25:38 EDT 2013 | emeto
Absolutely! I would say go even 0.5 to be safe.
Electronics Forum | Thu Apr 10 10:54:34 EDT 2003 | pjc
It will vary by placement machine mfg. and type. I had 4x Fuji CP3 (turret chip-shooter) and 2x Fuji IP2 (split axis general app-fine-pitch)and tracked component shrinkage at 0.05%-0.5% on average. Above 0.5% triggered maint. & process eng. response.
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
