Electronics Forum | Thu Jan 05 01:44:22 EST 2017 | soldertraining
In modern education, almost every Electronic Engineer must design a PCB. Once you get to know PCB design tools and functions, then creating a layout will become easier. Today, we find 0.4 mm pitch BGAs in every smartphone, and 0.3 mm ultra-fine pitch
Electronics Forum | Thu May 31 11:26:33 EDT 2007 | gsala
Tnks Patrick, additional infos..... we are just playng with different NC solder wires L-F, the best results in terms of solderability (faster solder flowing, holes filling up) it seams are coming from an ROM1, as we know, according to J-STD-004, or
Electronics Forum | Tue Oct 29 05:22:38 EST 2002 | kent
Thankyou very much for the information. Another question, what are the difficulty of dealing with the larger ball and tighter pitch? What is size of the ball is consider large and how far the distance for pitch is consider tight? Currently I have
Electronics Forum | Thu Jun 09 07:02:02 EDT 2005 | ajaydoshi
1. We do have PCB with 0402 component, Micro BGA ( 0.5mm pitch , 0.25 mm pad size ). PCB thickness is 0.8mm. What stencil thickness we should use. PCB size 40 mm X 60 mm 2. We have EKRA E4 , What will be optimum setting for above. Pressure, Scquge s
Electronics Forum | Mon Feb 20 15:45:03 EST 2006 | campos
thats the point: paste SMQ230 indium suggest a ramp between 0.5 a 1.0 degree,,but what ramp?? from 50 to 217 ,, 100 to 217,,,any idea?? i m using a ramp with .8 degree considering 50 a 217,,is teha correct????....thanks.
Electronics Forum | Tue Jan 20 10:30:56 EST 2009 | milas
Hi We have just specified the following thicknesses for the Nickel and Gold on an ENIG finish board. The baord is to be manufactured using a lead - free process. My question: Is the thickness we've specificed likely to gie us any issues during manuf
Electronics Forum | Wed Sep 01 05:29:40 EDT 2010 | arjan
We baked the parts just before assembly. 2>we baked the parts and store them in 4 days in drycab (60degC, Rh0,5%)and finally assembly 3> we baked the parts and refowed them on a leadfree profile and finally the assembly on the boards. The same we als
Electronics Forum | Thu Jan 16 05:10:46 EST 2020 | soupy
Hej, we have some connectors placed on our PCB. 2*30legs 0.5 After reflow we detect lifted legs in the AOI. Always on the outer corners. Is this something ye have experienced? And any possible solutions? Stuff we have tried: Checking the cop
Electronics Forum | Wed May 05 05:41:02 EDT 2021 | jineshjpr
Hi All, Need your suggestions on the below queries: 1. What will happen if the Au thickness maintained @ 0.5 to 1 micron (Where Ni Thick is within 3 to 5 microns) in 0.2mm Thickness FR4 PCB. 2. Is there any solder quality affcted during Reflow Solder
Electronics Forum | Tue Mar 05 22:35:49 EST 2002 | Nell
Hi Pete and Dave, I already check with Practical component, Tessera and TopLine Dummy component they said they only have up to 0.5mm pitch CSP. Anyway, thanks for your input... Do both of you know in the market right now is there any 0.4mm pitch C
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