Electronics Forum | Wed Dec 05 23:34:32 EST 2012 | aqueous
Typical conveyor speeds on leaded alloys and OA flux is 2 FPM. Typical conveyor speeds on lead-free alloys and OS flux is 0.5 FPM. Temperature should be 140 F. Most polypropylene inlines cleaners should not exceed 140 F. -Mike Konrad Aqueous Technol
Electronics Forum | Thu Dec 05 02:15:12 EST 2019 | sssamw
IPC 2221B mentions a minimum clearance of 0.5 mm between adjacent holes. A drill-to-drill spacing of 20 mils is a standard value in manufacturer design rules. For small annular rings and pad-to-pad clearance, the minimum via distance is often defin
Electronics Forum | Tue May 25 12:59:37 EDT 2004 | gregp
Mils to MM is actaully English to metric. 1 mil is equal to 1 thousandth of an inch (0.001")or 0.0254mm so... 12mil pitch qfp is 0.012" or 0.3mm 15mil pitch qfp is 0.015" or 0.4mm 20mil pitch qfp is 0.020" or 0.5mm (Numbers are rounded)
Electronics Forum | Wed May 03 11:51:37 EDT 2006 | samir
Chunks, We have custom nozzles here in Riyadh that are designed to solder through-hole with SMT 0805 R's and C's just 0.5mm away. ERSA charged an arm and a leg for these, so I buy them from my toolmaker, Asadulah , for half the price. They come in
Electronics Forum | Thu May 03 01:07:18 EDT 2007 | pavel_murtishev
Good morning, Worth system for 0.5mm or more pitch paste printing. For less pitch (uBGA, 0.4mm etc) framed stencil are preferred due to better tensioning. Main issue with them is handling. Stencil apertures that are used for tensioning might be easi
Electronics Forum | Tue May 22 06:28:50 EDT 2007 | aj
Hi All, I ran a prototype last week with one of the above mentioned connectors on board. During Inspection post reflow we noticed a solder ball had formed at the top of each leg. We used a 5thou stencil with 10% reduction on the width but it seems
Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv
Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica
Electronics Forum | Wed May 15 08:33:43 EDT 2013 | emeto
SAC is a lead free alloy that comes from SnAgCu(tin, silver, copper). When you say SAC305 that means 3%Ag 0.5%Cu and the rest is Tin. About the LF I assume that it means Lead Free, but what metal contents it has I can only guess.
Electronics Forum | Fri Jun 26 22:13:42 EDT 2020 | jmelson
Can anybody who has a PPM-retrofitted Quad IV C tell me what they think? I'm still going around in circles trying to decide what to get. I am doing some TSSOP and QFP parts with 0.5 mm lead pitch and 0.65mm, and my current machine isn't accurate en
Electronics Forum | Fri May 13 22:24:47 EDT 2022 | glasscake
Try adding blow after mount before head up if your machine lets you. Make sure your placing the part into the solder paste as that will add some holding force as well. If your tips are spring loaded you can do some 0.5mm additional mounting height.
