Electronics Forum | Fri May 13 22:24:47 EDT 2022 | glasscake
Try adding blow after mount before head up if your machine lets you. Make sure your placing the part into the solder paste as that will add some holding force as well. If your tips are spring loaded you can do some 0.5mm additional mounting height.
Electronics Forum | Thu Mar 05 16:29:22 EST 1998 | Brian Stumm @ ETS
| Can anyone advise a good starting point for a temp profile for | on 0.05" and 1206 component boards? These boards are simple | by todays standards and do not contain any fine pitch or | other special components. | Thanks in advance... | MM Be hap
Electronics Forum | Wed Nov 23 19:50:23 EST 2016 | gmscribe
Hi guys, I'm working on a design involving a 223-pin BGA with 0.5mm pitch (ball size 0.3mm) with a 16-bit DDR3 controller involved. Currently routing a track between two balls is resulting in a track width of 0.1mm and a spacing of 0.077mm. Now the
Electronics Forum | Wed Nov 23 08:43:48 EST 2022 | charles_nguyen
I am having problem with plated hole-copper spacing. I don't know if the gap between plated hole and copper can meet the capacity of PCB manufacturers. My board have 0.5oz copper weight on outer layer and distance of 0.177MM between plated hole and c
Electronics Forum | Thu Oct 27 06:05:50 EDT 2022 | angela t
SMT chip processing short-circuit bad phenomenon mostly in the fine pitch IC pins, mostly in the 0.5mm and the following pitch between the IC pins, because its spacing is small, improperly designed template or printing a slight omission is very easy
Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae
Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re
Electronics Forum | Wed Aug 21 20:11:34 EDT 2002 | mitch
We are going to begin using a 64 pin 10mm QFP with 0.5mm lead pitch. I was recently asked if we need to purchase our PCB with E3 coating instead of tinned pads when using the .5 pitch. The concept being suggested is that the E3 coating will give us b
Electronics Forum | Tue Jan 30 17:58:49 EST 2007 | flipit
Hi, I would not be too concerned about what the shape of your wirebonding fiducial is. Cross, Square, Diamond, Circle, will all work well for you. I use a "+" and a diamond. Your machine magnification will be great, so don't make the fiducials to
Electronics Forum | Sun Sep 02 07:55:19 EDT 2007 | lennielly
Hi every one I would like to have some inputs here,I would be very appreciated if you can give your suggestion; Currently we are working on 2 underfilled BGAs with SRT-1800 rework station(hot air type),one is mounted on a single sided PCB whereas the
Electronics Forum | Tue Apr 22 03:46:19 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
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