518 0,05 results

Electronics Forum: 0

BGA's and the Fuji IP2

Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef

Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.

Imm Silver tarnish?

Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman

Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.

Lead Free finish

Electronics Forum | Tue Oct 28 12:02:11 EDT 2008 | milas

Hi We have recently specified the following on a bareboard that has an ENIG finish. Does it sound about right or is it likely to give me problems ? Nickel : 3uM � 7uM Gold : 0.05 uM � 0.1 uM Thanks in advance

ENIG

Electronics Forum | Thu Jan 22 05:29:25 EST 2009 | johanhuizing

I think IPC-4552 is define the thickness of Nickel as: 3 to 6�m and Gold as: 0,05�m minimum

about solder bridge

Electronics Forum | Wed Apr 05 23:56:02 EDT 2000 | angela

Recently we have serious problem of our 0.5mm pitch QFP solder bridge. I check the viscosity of the Litton Kester paster. It's roumd about 700 is it too low. And do you have god solution about it? thanks alot

Aperture Reduction for QFP (fine pitch)

Electronics Forum | Mon Sep 20 20:51:36 EDT 1999 | Greg H.

My stencil thickness is 6 mil and we got qfp's with fine pitch. how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? thanks

support pins for double sided boards

Electronics Forum | Tue Sep 05 06:23:19 EDT 2006 | jonatf

Hi guys, I want to improve the set up of our printing machine(EKRA) especially on a 0.5mm thickness double sided boards.I find the support pins very time consuming.. any advice?? thanks.