Electronics Forum | Fri Jun 20 12:44:18 EDT 2003 | sasha
We had this problem with 0805 0.1 mF also. This problem was only with this capacitor. We have replaced all these capacitor after the ninth occurrence. My opinion - it is a defect of the manufacturer. Please inform the manufacturer of your capacitor.
Electronics Forum | Thu Dec 16 13:10:30 EST 2004 | chics
100 Centipoise = 1 Poise 1 Centipoise = 1 mPa s (Millipascal Second) 1 Poise = 0.1 Pa s (Pascal Second) Centipoise = Centistoke x Density
Electronics Forum | Tue Jun 07 20:19:31 EDT 2005 | davef
That depends a great deal on what you are cleaning and how clean do you want to get the substrate. We've seen cases where 0.1 uS-cm was insufficiently good and others where 10 uS-cm was more than sufficient.
Electronics Forum | Tue Jan 17 10:17:55 EST 2006 | Loco
Solder balls that have more than 0,1% PB are not RoHS compliant. It might be RoHS compatible meaning it can handle the higher temperatures used in a leadfree process.
Electronics Forum | Tue Sep 19 21:24:59 EDT 2006 | davef
JEDEC - http://en.wikipedia.org/wiki/JEDEC IPC - http://www.ipc.org/contentpage.asp?Pageid=2.1.0.1 You should use the design rule that produces the best results.
Electronics Forum | Tue Oct 28 12:02:11 EDT 2008 | milas
Hi We have recently specified the following on a bareboard that has an ENIG finish. Does it sound about right or is it likely to give me problems ? Nickel : 3uM � 7uM Gold : 0.05 uM � 0.1 uM Thanks in advance
Electronics Forum | Wed Apr 07 03:44:40 EDT 2010 | jackevest
The missing rate spec. of normal machine is under 0.3%, for our experience 0.1% is normal for average, if you can maintain the machine well, like the nozzle cleaning, feeder maitain...you can keep the 0.05%.
Electronics Forum | Thu Aug 26 03:58:32 EDT 2010 | jacki
Hi all Did anyone encounter that the thermal crack failure or any failure issue by using the Kemet Ceramic Cap, particularly 0.1uF,while wave soldering? Before using this part, I want to clarify whether it is suitable for our process or not. Thanks i
Electronics Forum | Thu Sep 02 20:39:39 EDT 2010 | Jacki
Hi davf Our process is the manufacturing burn-in-bord, SMT,insert sockets, wave and touch up. 1 board needs 0.1UF about 3k+ components.Kemet recommanded to use the reflow machine for Ceramic Cap when i chked its website.
Electronics Forum | Tue Sep 13 01:52:53 EDT 2011 | SheanDalton
My recollection is that RoHS limits for lead is 0.1% of the weight of any homogeneous material in the assembly.
