Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
Electronics Forum | Thu Jan 12 15:36:59 EST 2012 | swag
I've got specialized tooling I'm building for SMT processing. It requires a 0.125" thick sheet of high temp. silicon rubber cut to shape. Does anyone know of someone who can cut silicon sheets to a specific pattern/design?
Electronics Forum | Mon Nov 26 14:48:43 EST 2001 | PeteC
The tooling fixture has tooling pins to accomidate your PCBs. Typical PCB tooling holes are 0.125" dia. non-plated thru holes and 0.250"x0.250" from the edge of the PCB. Check out this link to EMC Global Technologies. They mfg. tooling fixtures for U
Electronics Forum | Mon Sep 21 18:57:23 EDT 1998 | Dave N.
Currently we are having an issue with our current PCB routing cutters in 0.125". It has come to our attention that the vendor has set the mean diameter to be .1235" +/-.001". As such, we recieve a number of cutters in the .1225 realm. This has caused
Electronics Forum | Tue Apr 12 19:31:39 EDT 2005 | davef
Tell your fab that you'd like your ENIG according to IPC-4552. Just so that you know, IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended spec
Electronics Forum | Tue Jul 05 10:27:34 EDT 2005 | GEB
The nozzles are brand new too (got them friday). 08MPF (0.08") is their part number. I tried using the air kiss feature in the setup mode and found that it blew the nozzle off the nozzle holder, not sure if this is ment to happen in this mode, but t
Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk
Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector
Electronics Forum | Tue Oct 28 19:47:05 EDT 2008 | davef
Your gold might be a bit thin after you consider fabricator's tolerance. IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended specification is
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
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