Electronics Forum | Thu Aug 24 08:46:15 EDT 2006 | Chunks
I too had to reduce by 50% because of floating (0.006"). But, most recommendations are for pads with via perforations. So if you are mounting to a flat pad, reduce even more.
Electronics Forum | Tue May 24 19:35:36 EDT 2005 | davef
Certainly, most often, the focus of pot analysis is directed at controlling impurities. Maintaining proper level of tin is important, also. When the portion of tin decreases: * Liquidous temperature increases. * Ability to wet decreases. * Solder c
Electronics Forum | Tue Nov 09 13:12:26 EST 1999 | Dave F
Steve: Sure, but let's figure it out for you!!! ;-) Here�s some sample calculations. Your results may vary, void where prohibited, etc 20 PITCH: Pinched aperture volume: 0.010"X0.050"X0.005" = 2.5 uin^3 Zippered aperture volume: (0.015"X~0.5)
Electronics Forum | Thu Jan 04 03:01:34 EST 2001 | Sal
Guys Has anybody out there purchased or had any experience with the ECD Fluxometer. I've been shown a very quick demonsration but I'm still not 100% confident. For instance the mesh thickness is 0.006 mil and the yet the thickness of our boards are
Electronics Forum | Tue Mar 16 03:28:18 EST 1999 | Scott Davies
Al, In general, I would agree with Justin, i.e. contact printing with a 0.007" stencil is great for 0603 - 1206 size components. However, we also place 0.025" pitch QFP components. We use a 0.006" laser cut stencil and I have found through trial an
Electronics Forum | Mon Dec 21 17:50:55 EST 1998 | anamonus
| I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 1
Electronics Forum | Mon Nov 17 11:09:56 EST 2003 | Frank
Hi, I have a soldering problem with a header SMT straight single row of 8 pins. It's a samtec #TSM-108-03-T-SV-P (P&P). The first problem I have is an allignement one. I do not use alignement pin for now but I expect to use it. Concerning solder
Electronics Forum | Sat Mar 18 07:33:34 EST 2000 | Dave F
Jack: Two concerns with column devices: 1 Coplaniarity of the device and the board. 2 Adequate solder that you mentioned, becuase the columns will not be reflowing and you need to cloatthem with solder. You didn't describe your aperture, but even
Electronics Forum | Mon Mar 07 06:31:02 EST 2005 | pjc
The Camalot Gemini II is capable of dots for 0402 chip. What would an Electrovert person know about that? With a 32gauge needle you can put down as small as 0.006" dia dot. For information about dots for 0402 chips, please contact Camalot application
Electronics Forum | Tue Jan 24 20:00:39 EST 2012 | kahrpr
If you failed math like I did. A 0.005 inch stencil would work fine for those parts. Most stencils are 0.004in for fine pitch 1005s 201s. 0.005in is probably the most common generic stencil. 0.006in generally is if you need extra solder for big parts
