Electronics Forum | Fri Jan 06 17:20:47 EST 2006 | davef
Mike You get what you ask for. We ask for 0.001 inch minimum. If your supplier's published process range allows thickness below 0.001 inch minimum, you need to define your own acceptance criterion. We don't use average measurements in lot inspect
Electronics Forum | Tue May 07 08:04:17 EDT 2002 | Sir Alexandr
Sorry if info is useless, but placement machines must have own system programs for completly ajustment of placement in a gap about 0.01 mm . Also headblock camera has enought increment to found correct place and fiducial setups utility. Maybe your lo
Electronics Forum | Wed Jan 23 13:48:06 EST 2008 | flipit
You can do a destructive test to sort of check your process. Break off the flipchip and look for voids. I have used Namics 8437-2 for the last 7 or 8 years. Good stuff. Flows under a 0.001" gap with no voids. Chris
Electronics Forum | Fri Apr 25 13:30:45 EDT 2008 | flipit
I use Namics 8437-2 for micro BGA and flip chips. Will work for QFN or MLF after soldering. Flows well under gaps as thin as 0.001". Cure in 5-10 min at 150 C. Rock solid product. Is bit expensive. Is from Japan.
Electronics Forum | Wed Sep 23 13:00:08 EDT 2020 | rsatmech
Hi Ameen, As I said before my defect rate is 0.001% and i am planning to reduce the stencil opening only. Will share the result once I implement it. Expected to complete it withing next week. Thank you.
Electronics Forum | Mon Aug 04 17:35:08 EDT 2003 | Dean
If you lay a flat edge on the PBGA, it is visibly warped? How much of a warp? 0.001, 0.010, 0.050 what? What is your pcb temperature just prior to entering the spike process (zone or step or what ever you call it)? Is it between 165 and 175 C?
Electronics Forum | Tue May 25 12:59:37 EDT 2004 | gregp
Mils to MM is actaully English to metric. 1 mil is equal to 1 thousandth of an inch (0.001")or 0.0254mm so... 12mil pitch qfp is 0.012" or 0.3mm 15mil pitch qfp is 0.015" or 0.4mm 20mil pitch qfp is 0.020" or 0.5mm (Numbers are rounded)
Electronics Forum | Fri Sep 30 10:07:44 EDT 2005 | davef
Alternate explanations are: * Your reflow profile needs to be tweeked. * Bumps under a die look different than elsewhere on the package. Severe creases may indicate a problem, but creases of only a 0.001 to 0.002" deep should not pose any difficulti
Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef
NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.
Electronics Forum | Wed Sep 22 13:56:24 EDT 2004 | GS
Hello everybody, are this the values still required by RoHS or there have been some modification ? - Maximum concentration Lead (Pb) 0,1 weight% - value of heavy metals Mercury 0,1 weight% - Cadmium 0,01 weight% - Chromium VI 0,1 weight% - Maximum
