Electronics Forum | Tue May 30 07:41:21 EDT 2006 | davef
Aspect ratio: The ratio of a via�s length or depth to its pre-plated diameter. So, in your case, either * 6=0.093/x, calculating x=0.093/6=0.016 as the smallest via hole diameter. ... OR * 6=y/0.01, calculating y=6*0.01=0.06 as the maximum board th
Electronics Forum | Fri Sep 17 03:46:31 EDT 1999 | Charles Stringer
| | I am not familiar with the "mil" metric. How many inches is in 1 mil? | | | | ...or 10 mil? | | | | | each mil = .001" | | Earl Moon | At risk of informing someones grandmother on the art of removing the contents of an egg without breaking
Electronics Forum | Tue Nov 04 17:08:04 EST 2003 | davef
We have this in our hydrometer use notes. We assume it's from our hydrometer supplier. Temperature Correction All hydrometer readings must be corrected from the temperature they were read at, to the temperature the hydrometer was designed for. Mo
Electronics Forum | Fri Jul 30 17:17:08 EDT 2004 | cvega
GPD Global provides a line of system to for small volume solder paste and condutive adhesive dispensing know as the MicroMax. Our systems have an accuracy of 0.001" at the needle tip, capability of two valve mountings, integrated closed loop needle
Electronics Forum | Fri Jan 06 11:29:28 EST 2006 | mdemos1
Hi. I was curious what some common accept/reject criteria would be on copper wall thickness. For instance, if 1 ounce copper is used, I believe the IPC specification is 0.001" minimum thickness. Should the order be rejected if there is one measure
Electronics Forum | Wed Oct 25 12:14:35 EDT 2006 | GS
Yes SWAG you are right, heat could be dangerous for the parts to be removed. Any way it is not so easy to remove epoxy adhesive (3609) once it is cured. By heating the adhesive (over his TG temperature)it gets softened and by using a mec
Electronics Forum | Wed Jan 19 22:28:20 EST 2000 | Dave F
Taking things from a slightly different angle: Cost of assembling various packages based on volume: C/R placement: |$0.01 to 0.04 per part SOIC: | $0.03 PLCC based on lead count: | 20-39 $0.16 | 40-59 $0.18 | 60-79 $0.20 | 80-
Electronics Forum | Wed Dec 13 20:42:57 EST 2000 | Dave F
Material Dk @ 1GHz tan d @ 1GHz Difunctional 4.40 0.020 Multifunctional 4.43 0.018 Polyimide 4.06 0.006 Cyanate ester 3.65 0.005 Bismaleimide triazine 2.94 0.011 PPO-epoxy 3.85 0.012 PTFE-glass 2.60 0.001 PTFE-mat-CE 2.79 0.003 PTFE-ceramic 4.06 0.00
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
Electronics Forum | Tue Aug 28 14:21:39 EDT 2001 | Scott B
You have to be careful here. The figure is expressed as placement accuracy, not process quality therefore 3 sigma does not relate to 2700 PPM defects but 2700 parts per million placed outwith 15microns (0.0006" / 0.6thou). Extrapolating the distribu
