Electronics Forum | Mon Jun 06 16:09:03 EDT 2005 | avalancher
Grant, As a MYDATA user, your comments worry me. You state that the MDYATA's are not stable or reliable? I am currently placing 0201's with the HYDRA head (at appx 15K/hr) with 0.01% fallout/bad placement. I also place a large range of fine p
Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
Electronics Forum | Tue Jun 26 21:41:10 EDT 2007 | davef
4.4 Determine the amount of flux on the board. 4.4.1 Get a piece of corrugated cardboard and a weighing scale accurate to 0.01 grams. NOTE: Use cardboard with alcohol fluxes to slow their evaporation and get good data. 4.4.2 Weigh the cardboard. 4.4
Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler
The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs
Electronics Forum | Wed Oct 13 12:12:04 EDT 1999 | Bill Haynes
Hello Morris, I hope that my superiors don't see your message or they might have me go through all of that to calculate my cost per part mounted. One of the things that has helped me out considerably is an Accounting report that gives me all
Electronics Forum | Thu Apr 21 17:46:17 EDT 2005 | Frank
Russ, Your math is right, but you are converting the wrong direction. I belive: 0201s use millimeters for specification sizes, not inches. And 01005 use millimeters for specification sizes, not inches. And it may be like that for all passives, bu
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam
Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V
Electronics Forum | Tue Jan 18 08:40:42 EST 2000 | Dave F
Hey John: Chrys wrote a good description on calculating flux density a while back. Here is our version of her procedure: 4.3 Determine the amount of flux on the board. 4.3.1 Get a piece of corrugated cardboard and a weighing scale accurate to 0.01
Electronics Forum | Tue Oct 05 06:28:32 EDT 1999 | Wayne S.
|hello morris type in quoting smt in archives and you will get some good insight. i had the same question at one time. wayne I am working on trying to define a cost per placement measure in our SMT assembly operations. | | Does anyone know where
.jpg)