Electronics Forum: 0.001 (Page 4 of 9)

Component description

Electronics Forum | Mon Dec 23 17:24:59 EST 2002 | davef

Guessing at the meaning of your description of �res., fmf, .100, 3010, 1, S�: * res - Resistor * fmf � �mf� tells you �metal film� �fmf� tells you �flame metal film� type * .100 - Precision tolerance 0.1%, although it could be power rating. * 3010 �

Quality performance specifications

Electronics Forum | Mon Mar 03 11:49:15 EST 2003 | msivigny

Hello marys, To determine the quality performance specification of your printers, dispensers or placement equipment, you must first know the operational accuracy and repeatability criteria from the equipment manufacturer. Only then can you determine

Camalot 2800

Electronics Forum | Wed Apr 02 14:47:59 EST 2003 | slthomas

Operating Parameters X Direction (left to right) 18.0 inches Y Direction (front to back) 18.0 inches Z Direction (up and down) 1.5 inches Operating Speeds Slew speed and point-to-point is 20 in./sec. Eight increments of speed control from 0.01 in./

Safety equipment for servicing solder wave

Electronics Forum | Thu Aug 21 09:05:07 EDT 2003 | davef

Use a cartridge that's approved [conform to OSHA 42 CFR 84] to provide respiratory protection against organic vapors, chlorine, hydrogen chloride, sulfur dioxide, chlorine dioxide, and hydrogen fluoride with a P100 particulate filter which is effecti

Conductive filled Vias on BGA

Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef

First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS

How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor

RoHS Calculation

Electronics Forum | Fri Oct 12 13:58:06 EDT 2007 | jdumont

I get the MCV thing. I dont see it spelled out anywhere when it says each component is to be treated singularly. To me �...a maximum concentration value of 0,1 % by weight in homogeneous materials for lead, mercury, hexavalent chromium, polybrominate

ENIG Thickness for Flex

Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef

Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and

IP3 special program

Electronics Forum | Thu Aug 04 22:02:25 EDT 2011 | fujiphil

IP3 camera calibration, you need the following: 1. Part camera resolution Jig. 2. 10mm nozzle for nozzle centering. 3. Button jig (skip). 4. Glass board and Glass parts. 1. Conduct the Camera resolution. Set the following Delta values: X=+/-0.1mm;

Fuji CP6 and IP3 specifications request

Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf

•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,


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