Electronics Forum: 0.001 (Page 7 of 9)

BGA failure when chamber test

Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta

Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the

Quad IVc Part rejection issue

Electronics Forum | Sat Aug 18 00:49:56 EDT 2012 | audere

When I see this on my QSP2 it is always caused by the nozzle not seating ideally but I tend to set my tolerances really tight. To test mount a nozzle and look at Z height. Now pick up the part (which in my case will suck the nozzle upward due to the

Mixing no-clean solder with activated

Electronics Forum | Tue Jun 26 19:51:31 EDT 2001 | davef

Rosin. A hard, natural resin, consisting of abietic acid [and pimaric acids in Europe] and their isomers, some fatty acids, and terepene hydrocarbons. Rosin is extracted from pine tree stumps. It�s an organic material distilled from oleoresin in p

Re: Dusted By Dross -what a wake-up

Electronics Forum | Fri May 19 11:20:12 EDT 2000 | John Thorup

Dave - well said ScottM - I'm appalled - Your management sounds like a throwback to an early industrial age where the workers were treated as a commodity. It's not right to do only what you're forced to do when protecting human beings and the enviro

Solder joint srength

Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef

Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l

Re: Cost per placement measure

Electronics Forum | Tue Oct 05 01:22:46 EDT 1999 | Karlin

| I am working on trying to define a cost per placement measure in our SMT assembly operations. | | Does anyone know where I might find a published industry average that we may compare to? | | I�ve heard it stated that an industry average is less t

Capability Process CPk

Electronics Forum | Mon Mar 10 15:52:26 EST 2003 | eagle-eyed-one

Hello Neil, I absolutely agree with the conclusion of limits as you have stated. There are 2 sets of limits in which machines can be measured against for compliant performance. First and most critical being the quality performance specification limit

Terminal plating

Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef

Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl

Re: Solder mask materials and equitements wanted

Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F

| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo

Tenting via(s) under BGA & CSP?

Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef

First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate


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