Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Dec 08 19:14:38 EST 2005 | khp_armin
We are encountering insufficient solder paste. Our stencil thickness is 0.13 mm and our printing pressure is 0.08 MPa our solder paste is Tamura TLF-204-19A. Please advice how to solve this problem.
Electronics Forum | Wed Nov 07 17:10:15 EST 2001 | davef
If you don�t paste / reflow solder on the pads, they will never bridge. ;-) A design with a 0.13mm gap between pads will challenge equipment, materials, and process.
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Fri Nov 16 18:08:32 EST 2007 | mika
So you are saying that 0.13 mm stencil thichknes and 20% reduction of the middle cooling pad is working for you? Just as I said.. Best Regards, Mika Ps. Keep in mind that the QFN is designed to do some heavy work, while enough "heat transfer" occur.
Electronics Forum | Fri Aug 07 20:07:16 EDT 2020 | emeto
Based on datasheet you can have balls with significant variation(twice volume) 0.13Sqr/0.19sqr = 0.46 I would suggest you tighten the machine recognition control. You will recognize BGA balls that are very different in size and reject the part. This
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
