Electronics Forum: 0.026 (Page 1 of 1)

Re: Baking PCB's before Assembly

Electronics Forum | Mon Feb 28 17:16:38 EST 2000 | Stu Leech

We just got a lesson on the effectiveness of heat sealed metalized vapor barrier bags. A customer sent us two bags of 100% saturated PBG components by air freight. This was for a demoisturizing test. When we found the devices 80% dry when they arrive

Re: Baking PCB's before Assembly

Electronics Forum | Mon Feb 28 17:16:38 EST 2000 | Stu Leech

We just got a lesson on the effectiveness of heat sealed metalized vapor barrier bags. A customer sent us two bags of 100% saturated PBG components by air freight. This was for a demoisturizing test. When we found the devices 80% dry when they arrive

WLCSP Assembly options

Electronics Forum | Tue Mar 16 18:11:54 EDT 2021 | grahamcooper22

I am wondering, I have an application for assembling a 0.4mm WLCSP to a pcb....the solder sphere size is 0.26mm...would you print paste in the normal printing process and then place the device and reflow...or would you use a fluxing station on the pi

Re: solder thief guidelines

Electronics Forum | Tue Aug 04 12:32:13 EDT 1998 | Bob Willis

The design rules for solder thiefs are that the extra pads must be bigger than the proceeding pads to be worth while as a minimum guide the pad is 3x the size of the proceeding pad so if the pad is 0.030" the thief would be 0.090" wide. As steve has

Paste Dispensing

Electronics Forum | Thu Jan 10 22:55:24 EST 2002 | davef

You are sure taking you sweet time getting this thing running. You're getting too much beach time. NOZZLE SELECTION Typically, the only rule of thumb that applies to choosing the correct nozzle ID is that it should be one half of the required dot d

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