Electronics Forum: 0.10 (Page 1 of 4)

Universal 4796 HSP Users & 0402's

Electronics Forum | Thu Jun 16 18:23:52 EDT 2005 | Jason Fullerton

Check your pick height/depth. Check your feeder alignment. We run 0402s at 0.10 tact. We run 0201s at 0.20 tact, but only because I don't require any more throughput - I have placed them at 0.10 during testing, and there are companies that place th

HSP

Electronics Forum | Wed Jan 13 16:48:52 EST 1999 | Doug Sanders

Question about HSP 4796A (36,000 cph). What is the maximum XY table movement to maintain 0.10 cycle time.

solder paste storage to -40 degree celsius

Electronics Forum | Tue Jan 14 07:33:16 EST 2014 | leardkattiya

Hi I have solder paste that suppose to be stored to 0 - 10 degree celsius. However due to broken fridge, we decided to stored on -40 degree celsius freezer. Does the solder paste still good to be use? Please help.

solder paste storage to -40 degree celsius

Electronics Forum | Wed Jan 15 03:07:47 EST 2014 | aflex

If the supplier has prescribed the storage temperature between 0 - 10 degree celsius, then it means that it work effectively if stored in that temperature range.

Assembleon offline software

Electronics Forum | Tue Mar 31 03:07:18 EDT 2020 | sarason

The software and the site has an English option that works fine. links here:- https://ealead-e.ucoz.com/ https://ealead-e.ucoz.com/index/eps/0-10 sarason

Aluminum wire bonding

Electronics Forum | Sun May 26 10:21:46 EDT 2002 | V.RAMANAND KINI

We buy PCBs for aluminium wire bonding. Our PCBs have 0.25 mm square pads for bonding and 0.10 or 0.15 mm gap between circuit traces/tracks. We do not have any problem. Our vendor gives 9 microns of Nickel and 0.03 microns of gold.

Stencil design

Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran

I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas

Large Board Assembly

Electronics Forum | Fri Nov 09 14:34:30 EST 2001 | vickt

As mentioned in other replies, the Universal GSM has expanded capabilities....As for the UIC HSP's....the 4796L can handle an 18" x 20" panel as standard, and has options to go up to 18" x 24.5". Did I mention that the 4796L places at a 0.10 tact ti

QFP Coplanarity & Alloy 42

Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef

We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead

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