Electronics Forum | Wed Aug 09 04:09:04 EDT 2000 | Jarno Py�ri�
Hello. I think, good stencil apertures is 80% from pad. And stencil thickness is 0.15mm - 0.20mm. I use 0.15mm thick stencil almost every pcb. Sorry my very bad english but i too learning. :)
Electronics Forum | Mon Jun 13 14:34:16 EDT 2005 | peter ng
The stencil thickness should be 5.5 mils.The squeeze speed around 20mm/s,print gap 0.15mm,print separation 0.3mm/s.
Electronics Forum | Fri Jun 15 05:28:55 EDT 2012 | eniac
DeanM, if I understood correct, you use fiducial with dimension 0.1 mm and increased it to 0.15 mm. Why use use small fiducials? You don't have free space on your PCBs?
Electronics Forum | Fri Dec 03 08:06:23 EST 1999 | Mark Anderson
Firstly, Verify your Z-height per the procedure in the Maintenance manual. In general, release the placement stopper and rotate cam onto flat surface of board with z-axis at zero. There should be 0.15 mm compression of the spring
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Tue Feb 23 04:54:54 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran
I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.
Electronics Forum | Sun May 26 10:21:46 EDT 2002 | V.RAMANAND KINI
We buy PCBs for aluminium wire bonding. Our PCBs have 0.25 mm square pads for bonding and 0.10 or 0.15 mm gap between circuit traces/tracks. We do not have any problem. Our vendor gives 9 microns of Nickel and 0.03 microns of gold.
Electronics Forum | Fri Mar 17 07:42:51 EST 2006 | vicknesh28
Copper is the base material for the lead. It's tin/lead plated. I finally got profile. Here are the parameters" Peak : 219 Max (+) Slope : 2.29 Max (-) Slope : -1.94 Time above 200 deg. C : 50s Time 140C - 160C : 126s Additional info : Stencil thic
