Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
Electronics Forum | Tue Aug 03 14:46:25 EDT 2004 | russ
We recommend to the designers "the smallest diameter that you can get away with", that will help reduce the solder scavenging into via diring reflow. unless you are planning on having them filled as Dave F mentioned. Russ
Electronics Forum | C.W |
Sat Jul 31 17:29:18 EDT 2004
Electronics Forum | Tue Jan 11 13:39:11 EST 2000 | David
Is this a thru hole via or a blind via? What is the hole diameter? If blind, how deep is it?
Electronics Forum | Tue Aug 03 08:38:42 EDT 2004 | davef
Conductive epoxy is usually specified as less than 6:1 aspect ratio fill capable, while non-conductives are 10 to 14:1 (depends on which brand and who you ask).
Electronics Forum | Thu Aug 15 15:58:12 EDT 2002 | robertnguyen
To whom this may concern, I recently ran into the problem with vias on pads of BGA when place BGA and reflow gas trap on vias escape and result in ball having void greater than 50% of BGA diameter. The BGA pad is measured at 20 mils and the vias mea
Electronics Forum | Fri Sep 05 06:17:36 EDT 2014 | edriansyah
Hi, We have a problem with our BGA Pad. Our PWB manufacturer make the BGA Pad in irregular form. some big, some small. Please see the picture on attachment. BGA Detail BGA Pitch 0.5 mm BGA Ball 0.3 mm BGA Pad (big) 0.2 mm (as per gerber) BGA
Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F
Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
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