Electronics Forum | Wed Aug 21 20:11:34 EDT 2002 | mitch
We are going to begin using a 64 pin 10mm QFP with 0.5mm lead pitch. I was recently asked if we need to purchase our PCB with E3 coating instead of tinned pads when using the .5 pitch. The concept being suggested is that the E3 coating will give us b
Electronics Forum | Thu Jun 29 11:52:23 EDT 2000 | JAX
sree, There is no Definite. You have to make the call. If you think the previous info was on target, use the info provided to find out the appropriate percentage relation between ball diameter, pad diameter, and aperture size. If you already run BGA,
Electronics Forum | Thu Aug 05 04:51:37 EDT 2004 | Bryan
The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow ti
Electronics Forum | Mon Jun 05 14:17:18 EDT 2000 | C.K.
Dream: Yes, VIA's are connected to actual SMD pads via traces - roughly .030" from the pad. The VIA is .013" in diameter, and the excess solder bleeds out of the actual VIA barrel after the 1st reflow.... -CK
Electronics Forum | Tue Sep 01 19:31:36 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Mon Jan 31 08:30:41 EST 2005 | davef
Yes, probing via is perfectly acceptable. Via: * Pad diameter is 0.028 inch * Via pitch minimum is 0.50 inch ... all of which is fairly common, even when probing test pads. [Your English is fine, at least as good a half the English speakers here.]
Electronics Forum | Tue Sep 01 20:36:05 EDT 1998 | Rin Or
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Wed Mar 29 03:40:06 EST 2006 | Frank
The Juki 2060 can have both front and rear trolleys and you do not loose any feeder locations. My question was why can't the Assembleon put trolley on the rear? I recently visited a friend at a company that used a lot of Assembleon and compared run
Electronics Forum | Sun Jan 18 09:20:26 EST 2009 | davef
We're not sure of the condition of your solder paste. So, afte 24 hours, if it's: * Unused, in a reclosed container, maybe a week of life depending on the environment * Used, scrap A simple coalescence test can quickly determine the condition of sol
Electronics Forum | Wed Jul 16 18:46:46 EDT 2008 | mariss
emti, Thank you for the reply but I'm looking for a reasonable quality pcb mfg. We do SMT and thru-hole in house (3 Juki KE-750L machines) of our product. My problem is with the bare boards: holes poorly registered with top copper, solder masks mis
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