Electronics Forum | Sun Sep 07 13:33:50 EDT 2014 | horchak
Edri PCBA design and pad geometry is one of the critical factors for BGAs. Typically the pad size for collapsible balls is 80% of the ball diameter. Pad size consistency is critical. In your situation what will happen the larger pads will wick the s
Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon
| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab
Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike
| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.
Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
Electronics Forum | Tue Jun 12 10:13:10 EDT 2001 | techment
Thank you, Mr Dave. Specifically, there are tiny balls spreading on the boards ( on top of solder resists, and not encapsulated). They are not near to any land/pad or connector. I do not think they post any electrical problem. They are quite far away
Electronics Forum | Sun Aug 23 20:24:59 EDT 1998 | Karlin
Hi, Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. We have rule out the possibility of not printing any solder paste there
Electronics Forum | Wed Jul 03 14:34:45 EDT 2002 | razorsek
Jeff, what I generally use as a rule of thumb on multi-row connectors was a strip on the trailing side of the connector as it flows through the wave. The strip was always the same width as the diameter of your through-hole. The distance of the stri
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