Electronics Forum: 0.3 mm pop assembly (Page 1 of 2)

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla

I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks

5 or 6 mil thicjk stencil and no reduction.

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Fri Dec 28 17:02:04 EST 2007 | davef

We agree with Chunks

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Jan 02 15:32:27 EST 2008 | shrek

HA-HA-HA... Krikies. What are ya mate? A slavakian?

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Jan 09 19:04:48 EST 2008 | pnguyvu

5 mil thick is the max and no reduction Any question feel free give me a call @ 714-636-6211 or email me Steve@usastencils.com Regards Steve

Brd(Electroylic Gold finishing) got blisters

Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko

My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how

QFN PCB Pad no Drain Hole

Electronics Forum | Sat May 18 10:21:09 EDT 2013 | davef

isd.jww: Comments are: * Current thinking has flux volatiles being the major contributor to voiding, not scavanging by via * I have no reason to think that 0.3mm via won't gladly accept solder. Plug them, if that's a concern. * If your concern is ina

Flux encapsulant

Electronics Forum | Mon Apr 01 23:16:44 EST 2002 | dwoon

Hi, Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation. Does anyone has experience in actual production run? What is the possible effect for

High-speed solder paste dispensing. MY500, MY600, FX-D....?

Electronics Forum | Fri Jan 09 04:37:13 EST 2015 | jsolloway

Hi Jeff, We have both a MY500 (4 years) and a 600 (8 months) and were the first in the UK to have both. They work well for us, enough so that we no longer use a stencil printer. Like yourselves we are a high mix CEM we make about 500 different part

0201

Electronics Forum | Wed Feb 27 15:14:52 EST 2008 | gregf912

Senior, below, is correct. THe narrow view camera has to be upgraded in order to place 0201 components. Also to pick the parts you need the 0201 feeders. These feeders present the part 0.3 mm higher than the standard 0402 feeder. The part pickup heig

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0.3 mm pop assembly searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155