Electronics Forum: 0.4mm ptich bga (Page 1 of 4)

0.4mm pitch CSP Dummy Component

Electronics Forum | Tue Mar 05 22:35:49 EST 2002 | Nell

Hi Pete and Dave, I already check with Practical component, Tessera and TopLine Dummy component they said they only have up to 0.5mm pitch CSP. Anyway, thanks for your input... Do both of you know in the market right now is there any 0.4mm pitch C

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

0.4 mm Pitch BGA stencil design

Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp

I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us

Re: Micro BGA

Electronics Forum | Fri Jun 09 17:09:23 EDT 2000 | JAX

Khalid, Just from experiance the actual would be 0.4mm but the inspection size would be 0.3mm. This should not matter since you should be able to pull up the spec sheets on any part you place.( All you need is the Vendor and the manufacting part numb

15.7 mil QFP

Electronics Forum | Mon Jun 02 09:38:12 EDT 2003 | pjc

yo Evt, ".., what's the difference?". Answer: Huuuge!! between running 0.4mm pitch QFP and a BGA of same I/O, in terms of handling, storage, feeding (trays), p&p, inspection, test, rework, etc.......

SMT JET PRINTER VS JET DISPENSING

Electronics Forum | Mon Aug 13 09:20:46 EDT 2018 | sara_pcb

What is the difference between jet printing & jet dispensing. Our's is small prototyping, high reliability PCB assembly business. The SMT components used are up to 0.4 mm pitch BGA & 0201 size chips. Which is more suitable for us?

Step-up stencil: recommendation thickness

Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw

6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o

Hi Jandon, Thanks, I will try it on my DOE.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw

Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.

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