482 0.5 results

Electronics Forum: 0.5 (Page 1 of 49)

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI

What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.

0.5 mm pitch BGA

Electronics Forum | Mon Feb 28 06:06:04 EST 2005 | Guest

I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 10:24:48 EST 2005 | Guest

Balls are 0.30 mm diameter, with a height of 0.24 mm It's a 8*8 mm 184 pins BGA.

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc

Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components

ENIG; Au < 0.5 um to avoid solder joint embrittlement

Electronics Forum | Tue Jun 07 20:17:09 EDT 2022 | SMTA-64387182

Understood, Thanks, Joe

ENIG; Au < 0.5 um to avoid solder joint embrittlement

Electronics Forum | Thu Jun 02 14:23:36 EDT 2022 | SMTA-64387182

We are designing a new PCB that will include a 0.4 mm WLCSP IC package. The OEM’s application-note for this package states ENIG; Au

ENIG; Au < 0.5 um to avoid solder joint embrittlement

Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544

Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints

ENIG; Au < 0.5 um to avoid solder joint embrittlement

Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl

I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e

micro assembly technology inc. dispensing at 20um resolution

Electronics Forum | Mon Nov 15 15:31:54 EST 2004 | GP

We are looking for machine that can do the following: bonding of 0.5x0.5x0.8mm mm cramic part. - detect target surface position 1.5x0.8mm - dispance a drop of 0.8mm of epoxy adhesive on trget surface with position accuracy of +/-0.04mm. - pick the 0.