Electronics Forum | Wed Dec 05 17:44:25 EST 2001 | LloydG
we are in the process of design, plan to use a 0.5 mm pitch BGA. does someone has a recommended footprints. thx!
Electronics Forum | Fri Apr 25 07:15:50 EDT 2008 | davef
Please post a picture of your cross section.
Electronics Forum | Wed Apr 23 21:34:24 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Thu Apr 24 20:52:03 EDT 2008 | davef
Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicate the standard process reflow was inadequate. To understand this better, we'd want to measure temperatures at various points on the board during reflo
Electronics Forum | Thu Apr 24 21:52:18 EDT 2008 | fowlerchang
We have measured the temperature of CSP solder joint. The peak temperature is 232oC and the wetting time above 217oC is 30s. But we use leaded solder paste instead of lead free solder paste. I doubt why no crack of solder joint was observed after cr
Electronics Forum | Sun May 05 08:13:14 EDT 2002 | andysi
I am curreently in my final year of my HNC Mechatronics course. In the project section I am reviewing several screen printers for their suitability to run a new product containing 0.5mm pitch components. I would be interested in anyones opinion in
Electronics Forum | Tue May 07 08:18:12 EDT 2002 | Sir Alexandr
Almst quality of PCB with this pitch defined on used boards. Good board produses Fullmarks , look up to it , stencil parametrs isnt so critical but board material and layouts.
Electronics Forum | Thu May 09 17:22:56 EDT 2002 | davef
I have no opinion on the accuracy and repeatability tolerances you should be looking for on the vision system and the actual alignment of the stencil. I expect Cp=2 from my printer.
Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks
5 or 6 mil thicjk stencil and no reduction.