Electronics Forum: 0.5mm bga routing (Page 1 of 11)

6 layer board and routing bga package

Electronics Forum | Fri Feb 19 05:08:40 EST 2016 | truewanderer

Thank you Tsvetan Usunov

6 layer board and routing bga package

Electronics Forum | Tue Feb 16 13:58:02 EST 2016 | tsvetan

this document http://www.latticesemi.com/view_document?document_id=671 may be good start point but note that how to escape from the BGA is not big deal, how to route your filtering capcitors, grounding, impedance control lof you high speed signals ar

6 layer board and routing bga package

Electronics Forum | Thu Feb 11 07:24:40 EST 2016 | truewanderer

I'm planning to design the pcb of my project. The controller used is having 136 pins and the package is P-LFBGA. So i think i need to design a 6 layer board for better performance. I haven't designed a multi layer board before. So what are things tak

6 layer board and routing bga package

Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer

Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g

0.5mm pitch BGA

Electronics Forum | Wed Dec 05 17:44:25 EST 2001 | LloydG

we are in the process of design, plan to use a 0.5 mm pitch BGA. does someone has a recommended footprints. thx!

Best way to fan-out 0.5mm pitch BGA for fastest prototyping

Electronics Forum | Wed Nov 23 19:50:23 EST 2016 | gmscribe

Hi guys, I'm working on a design involving a 223-pin BGA with 0.5mm pitch (ball size 0.3mm) with a 16-bit DDR3 controller involved. Currently routing a track between two balls is resulting in a track width of 0.1mm and a spacing of 0.077mm. Now the

underfilling of bga

Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv

Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla

I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks

5 or 6 mil thicjk stencil and no reduction.

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Fri Dec 28 17:02:04 EST 2007 | davef

We agree with Chunks

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