Electronics Forum | Tue Mar 24 11:42:45 EST 1998 | Manfred Hofmann
I need SIL-pins with 3,175mm pitch, for assembling 0,63mm thick Hybridcircuits!! I tried to get these (comatel, nas)without success. Who can tell me a supplier for this? Preferable in Europe. Thank�s for help Fred
Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef
Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past
Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef
Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co
Electronics Forum | Thu Nov 25 21:43:49 EST 1999 | cklau
Via is normally a plated thru holes in (0.63 to 1.0 mm (0.025" to 0.040") diameter lands , which unless properly treated they must be located away from the component lands to prevent the solder migration off the component land during reflow soldering
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
Electronics Forum | Wed Jun 03 22:07:41 EDT 2009 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Mon Jan 23 22:53:31 EST 2012 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
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