Electronics Forum | Mon Jan 23 22:53:31 EST 2012 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Mon May 02 12:35:33 EDT 2016 | adamjs
Or try : http://www.sipad.com/ I think sipad is incredibly cool and would be the perfect solution, but is way too expensive. We're paying $0.80/each for four-layer ENIG boards, 50cm^2 with 0.125mm trace/space and 0.8mm-pitch LGA landings in lots of
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
