Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef
KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.
Electronics Forum | Mon Sep 26 07:56:38 EDT 2005 | pavel_murtishev
Hi! Try to make "R_AXIS_ACCURACY" calibration for all of FNC heads for back camera only. I met such problem on Topaz-X. There was clearly seen offset on 0.8mm pitch components. I simply calibrated all cameras for FNC nozzles and problem disappeared.
Electronics Forum | Mon Aug 07 09:39:28 EDT 2006 | KHHO
Dear Sir, To design PCB with 0.8mm pitch BGAs, is ENIG PCB is better than Tlectro-plating PCB? Why? Than, what is the most effective way to determine the connection between BGA and PCB is good and strong enough?
Electronics Forum | Fri Jul 18 10:04:32 EDT 2003 | jseagle
Hi all, I am looking for some recommendations on Underfill Equipment. Such as vendors, pumps, material, etc... We will be initially underfilling a 10mm x 10mm, 0.8mm pitch, 0.35mm ball uBGA on FR4 and going down in size and pitch from there. And
Electronics Forum | Mon Sep 03 10:50:47 EDT 2007 | kissanepat1
A suggestion for your stencil which works is as follows. Cut your stencil aperatures beyond your pads to a length of 0.1mm , this then allows the paste to pull back into the pad creating a blob of solder which can be inspected by AOI.Best length and
Electronics Forum | Mon Jan 24 08:42:25 EST 2005 | SLVito
Morning All, I have to choice between two axial through hole machines: Panasert AVK 3 and Universal VCD Sequencer 8. I will insert axial components with 0,45 mm to 0,8 mm component lead diameter and perform jumper wire insertion in the same machine.
Electronics Forum | Wed Jan 26 05:24:56 EST 2005 | SLVito
Morning All, I have to choice between two axial through hole machines: Panasert AVK 3 and Universal VCD Sequencer 8. I will insert axial components with 0,45 mm to 0,8 mm component lead diameter and perform jumper wire insertion in the same machine.
Electronics Forum | Tue Nov 12 17:11:32 EST 2013 | mondalaci
Hi Folks, I'm working on a LED display that is composed of multiple layers. What is interesting for the point of this discussion is the PCB layer and the light deflector layer on top of it. Please take a look at the related pictures at http://plus
Electronics Forum | Tue Mar 15 13:24:44 EST 2005 | pjc
There is equipment available to clean NC residues off low standoff devices, well below 0.8mm (0.031"), from Speedline Technologies- Electrovert and Accel. See this paper under Accel: "High Reliability Underfill Performance through Proper Flip-Chip D
Electronics Forum | Fri Nov 30 22:59:34 EST 2007 | bvdb
Hi Paul, It may not be the perfect replacement for a proper fiducial but I have had some success using thru-holes for fiducials. The tightest pitch part we place is 0.8mm however 0.032"). If the thru-holes are drilled accurately and you are able t
