Electronics Forum | Thu Dec 15 08:20:39 EST 2005 | jhernan9
The BGA pitch is 0.8 mm and stencil thickness is 0.005"
Electronics Forum | Mon Apr 03 17:22:14 EDT 2017 | peng682
yes, bob, usually below 0.8mm
Electronics Forum | Tue Feb 16 14:04:10 EST 2016 | tsvetan
We are designing board which have to plug in M.2 connector and thickness is limited to 0.8 mm The board is very complex with many BGAs and DDR3 memory chips and we will need 6 layers for routing. The problem is that we will need signals with 50, 90
Electronics Forum | Tue Feb 16 15:42:21 EST 2016 | sarason
When faced with a problem like this I sometimes look at competitive products and see what they have done. You may be able to get away with 4 layers if you have the space, however if it is jammed up that will not be an option. I presume that the total
Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC
Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!
Electronics Forum | Mon Sep 18 01:47:18 EDT 2017 | bukas
I would go with wire thickness + 0.4 to 0.8 mm for pad width, and pre-tinned lenght + 0.5mm what seems to me like problem is that it can easily roll off the pads in reflow oven
Electronics Forum | Thu Jun 29 09:12:27 EDT 2000 | sree
What is the best aperture opening for micrBGA with 0.8 mm ball pitch and 16 mils ball diameter?The pad size on the PCB is 12 mils.
Electronics Forum | Wed May 17 11:00:00 EDT 2000 | emmanuel
Has somebody yet process pcb (FR4) with a thickness of 0.8 mm ? Thank you for all kind of responses.
Electronics Forum | Wed Jun 12 22:35:03 EDT 2002 | jkhiew
We had alot of problem with melf diode short together after reflow soldering. The clearance is about 0.8mm & we used "v" shaped opening . PLease comment !
