Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang
we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,
Electronics Forum | Mon Sep 18 01:47:18 EDT 2017 | bukas
I would go with wire thickness + 0.4 to 0.8 mm for pad width, and pre-tinned lenght + 0.5mm what seems to me like problem is that it can easily roll off the pads in reflow oven
Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH
Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems
Electronics Forum | Tue Nov 12 17:11:32 EST 2013 | mondalaci
Hi Folks, I'm working on a LED display that is composed of multiple layers. What is interesting for the point of this discussion is the PCB layer and the light deflector layer on top of it. Please take a look at the related pictures at http://plus
Electronics Forum | Thu Jun 09 07:02:02 EDT 2005 | ajaydoshi
1. We do have PCB with 0402 component, Micro BGA ( 0.5mm pitch , 0.25 mm pad size ). PCB thickness is 0.8mm. What stencil thickness we should use. PCB size 40 mm X 60 mm 2. We have EKRA E4 , What will be optimum setting for above. Pressure, Scquge s
Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC
Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!
Electronics Forum | Fri Dec 16 04:41:30 EST 2005 | tk380514
A day and half is a life time for our solder paste, Almit V14L... but then we dont have in-line solder paste printers, we have micro BGA stencil that wont work with anything but new solder paste, 0.8mm pitch and pad size is 0.3mm, stencil thickness
Electronics Forum | Thu Jun 29 09:12:27 EDT 2000 | sree
What is the best aperture opening for micrBGA with 0.8 mm ball pitch and 16 mils ball diameter?The pad size on the PCB is 12 mils.
Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef
You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10
