Electronics Forum | Thu Jul 19 23:52:17 EDT 2001 | Victor
Load Factor = Board Length / (Board Length + Space) (you can get the maximum loading factor from the manufacturer, usually ranges from 0.5 to 0.9) Oven Throughput = (Conveyor Speed x Load Factor) / Length per Board
Electronics Forum | Thu Jul 10 02:49:34 EDT 2003 | emeto
Hi! One technique: 1. Remove all balls 2.Make a mask(stensil)for reballing.The holes of the mask must be 0.8-0.9 the size of the pads. 3. Reball chips 4. Reflow chips Good luck
Electronics Forum | Tue May 14 16:59:24 EDT 2013 | leeg
Cheers again. So if the bga is 1mm thick and with the balls 1.3 mm thick I should set the component height at 0.9 to be sure of cotrectly centering on the body ?
Electronics Forum | Mon Feb 27 06:18:32 EST 2012 | sarason
I am just releasing Version 1.0.0.9 Beta Release Added feeder swapping. minor fix in Mydata TP Sys 2.7 Added more Juki 2000 and 700 series and Yamaha YP/YG machines, more Panasonic machines. Updated Options tab, User interface cleansing Added Check
Electronics Forum | Thu Apr 28 12:23:14 EDT 2005 | Rob
Have you checked the placement height? it will need to be set down to about 0.5mm - 0.6mm, whereas you can get away with 0.9mm for 0603. Not a Panasonic expert but I've seen this nearly every time a customer has taken the step down. Cheers, Rob.
Electronics Forum | Wed Sep 19 21:04:57 EDT 2007 | wailiang81
Hi,davef, thanks for your concern. The condition was the pasted printed off with around 0.8~0.9mm from the land pattern. This will easy observe at QFP area. At fiducial, the stencil seens aligned accurately. Once solder bridge happend, its easy to
Electronics Forum | Fri Sep 22 08:22:17 EDT 2023 | linux
Hello All, This would be a question for someone with experience in PCB design, Intrusive reflow Narrow profile connector(Electrode Rectangular) L=1mm X W=0.9mm. What shape and size hole is required in the PCB to ensure sufficient solderability and re
Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang
we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,
Electronics Forum | Fri Feb 24 08:29:25 EST 2006 | davef
Step stencils are not widely used, due to: * Higher cost as compared to uniform thickness stencils * Danger of solder paste smearing at least close to the steps * Difficulty of cleaning the stepped stencil underside (the steps cannot be on the upper
Electronics Forum | Wed Oct 09 15:02:25 EDT 2002 | hartyl
hi, in our school we started a new project, decoding the 8 data-adresses of the LPT to a 7-segment-display. they wanted to make it display 0 - 9 and a dot if its bigger (one nibble). i thought this is nonsense, i'd decode it to a hex-number. ok, now
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