Electronics Forum: 012 (Page 6 of 13)

.5mm BGA

Electronics Forum | Fri Feb 20 13:25:00 EST 2004 | russ

Help! i just rec'd my next job from our marketing people and it has a .5mm pitch BGA 8mmX8mm size. Along with this kit came the stencil. So, I have never placed this fine of a BGA before and I am pretty worried about the stencil releasing the past

Soldermask Defined BGA Pads

Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe

We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t

Misalignment Brainstorm - Fiducials On Board VS On Breakaway Tab

Electronics Forum | Wed Apr 29 17:51:44 EDT 2009 | smt_guy

One more thing: I have a Panelized PCB with 8 boards on the X directions. As I move to the next PCB towards the right my misalignment moves to the right by 0.02mm. By the time I reach the 8th PCB I'm Off by between 0.12mm to 0.14mm. My fine pitch

Alternatives to ricocel pallets that absorb less heat

Electronics Forum | Thu Jan 21 09:55:14 EST 2016 | Sam

We are running a project that is 5 years old. We have yet to resolve all of the issues. Out biggest is warping due to the board being .012" thick. We have created a custom pallet (ricocel) and pallet cover (FR4) to sandwich the board but I am afraid

Samsung CP45 Swing Mirror motor replacement

Electronics Forum | Mon May 16 00:33:18 EDT 2016 | wesleyintelli

Our CP45 swing mirror motor (Panasonic AC Servo Motor: MSMA012A3A) recently jammed and required replacement. I replaced the motor with a new one however it won't home. A link to a video of the motor attempting to home can be seen below. I am wonderin

uBGA (.5mm pitch) printing woes

Electronics Forum | Fri Sep 08 01:08:10 EDT 2017 | tsvetan

The material is 0.12mm stainless steel, electropolished it's thick for fine pitch but we have lot of other big components on the board which do not solder good if we use 0.1mm thickness stencil. The 0.3 mm apretures are big enough and have good rele

Step-up stencil: recommendation thickness

Electronics Forum | Wed May 22 12:00:13 EDT 2019 | gregoireg

Thanks. It starts to make sense. There is a formula at the bottom of this page: http://www.circuitinsight.com/programs/50456.html It says: Stencil Thickness = 2.64mil + 0.0831 * pitch of component in mil. for 1.13mm, that gives exactly 0.16mm. So,

SMD module moving during reflow

Electronics Forum | Thu Jun 20 23:28:15 EDT 2019 | SMTA-David

How can I upload image to this forum? I can show you the pad layout. I am thinking maybe too much solder. I used 0.16mm thick stencil but notice many us 0.12mm thickness. Also, cream layer is 100% of pad surface, I know for fine pitch parts it is r

solder ball

Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw

From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce

Melfs drops down from nozzle.

Electronics Forum | Tue Sep 05 10:43:02 EDT 2023 | klauss

I've some special nozzles for melf packaged diodes. When I am trying to mount it on pcb, nozzle picks up the diode and place it well. After 5-6 times of placing, diodes keep drops down to it's package from nozzle. It's like the vacuum doesn't enough


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