Electronics Forum: 012 (Page 7 of 13)

8 mil pitch lead frame Device? Where?

Electronics Forum | Sat Sep 12 10:47:00 EDT 1998 | Jon Medernach

I am aware that the Intel processor is available in a 0.012" leadframe, as a TAB product ( which can be excised and placed with may P&P machines but I do not know of any 0.008" leadframes, Bumped Die are at these pitches and frankly I would bet dime

Re: 8 mil placement, part Deaux!! / My Mistake - Sorry

Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F

0.050" -> 50 mil -> 50 pitch | 0.80 mm -> 0.032" -> 32 mil -> 32 pitch | 0.64 mm -> 0.025" -> 25 mil -> 25 pitch | 0.50 mm -> 0.020" -> 20 mil -> 20 pitch | 0.40 mm -> 0.016" -> 16 mil -> 16 pitch | 0.20 mm -> 0.012" -> 12 mil -> 12 pitch | Dave F Y

SMD solder joint calculation

Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette

In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b

Flexa

Electronics Forum | Tue Jul 22 08:26:03 EDT 2008 | mmjm_1099

I would suggest calling Fuji and they can do a webex with you. But, if you wish to figure it out yourself here you go. 1.) Go into the program you wish to change. 2.) CP43 machine configuration 3.) Pick which holder you wish to change and a drop dow

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Nov 09 13:12:26 EST 1999 | Dave F

Steve: Sure, but let's figure it out for you!!! ;-) Here�s some sample calculations. Your results may vary, void where prohibited, etc 20 PITCH: Pinched aperture volume: 0.010"X0.050"X0.005" = 2.5 uin^3 Zippered aperture volume: (0.015"X~0.5)

Re: Via's in BGA pads

Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney

| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces

Re: What is spec on stretch????

Electronics Forum | Fri Apr 16 17:19:59 EDT 1999 | Dave F

| | Hi, | | I just cheesed my previous attempt at this. I looked through IPC 600 and couldn't find anything relating to dimensional stability of a board with regard to stretch. I found bow and twist but nothing on size. I have a PCB that is .030"

Re: Solder Stencil

Electronics Forum | Fri Aug 28 11:14:46 EDT 1998 | Justin Medernach

| General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of the pa

Adhesive Dispense Equipment

Electronics Forum | Tue Oct 30 22:08:45 EST 2001 | flynhi34

I have not looked into eutectic die attach. My dies are about .012" square and could get smaller. Currently using a Epoxytech conductive adhesive. I am going to go out and look at equipment and build samples. Some vendores state they can do .010"

Fuji CP6 5000

Electronics Forum | Wed Jan 23 22:30:46 EST 2002 | Jones

The CP-65E handles a wide range of board sizes, including large boards up to 508 x 457 mm or 20 x 18 inches. Handling consumer as well as industrial applications, this durable and highly efficient machine achieves a cycle time of 0.12 seconds/shot an


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