Electronics Forum: 012 (Page 8 of 13)

IPC Spec for PTH Hole Size Tolerance

Electronics Forum | Wed Apr 10 22:23:48 EDT 2002 | davef

IPC-6012A, 3.4.1 has words to the effect of: Hole size tolerance and hole pattern accuracy shall be as specified in the procurement documentation. Our fab says: Standard Drill Sizes Drill Number ||Hole Size ||Finished Hole Size 70 ||0.028" ||0.02

IPC Spec for PTH Hole Size Tolerance

Electronics Forum | Wed Apr 10 22:24:30 EDT 2002 | davef

IPC-6012A, 3.4.1 has words to the effect of: Hole size tolerance and hole pattern accuracy shall be as specified in the procurement documentation. Our fab says: Standard Drill Sizes Drill Number ||Hole Size ||Finished Hole Size 70 ||0.028" ||0.02

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac

Voiding in CSP Ground pad

Electronics Forum | Mon Feb 03 22:48:00 EST 2003 | vinesh

Hi all, We are using small CSPs (10x10mm) in one of our products which has a big ground pad in the center (7x7mm). The maximum voiding allowed on this big pad is also no greater than 25% which we are finding very hard to achieve. The centre pad ha

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas

THT connector solder thieves

Electronics Forum | Thu Feb 13 10:15:09 EST 2003 | dwanzek

Bridges are front to back. To me this seems to indicate thieves would pull the solder away from the pins. I feel I am correct in that theory. Yes, it would be a good idea for us to bring in a consultant but I have the opportunity right now to make b

Optimal Speed for Universal Chip Shooters

Electronics Forum | Tue Sep 16 09:02:16 EDT 2003 | Graeme

Murtuza You have recieved loads of good info mainly all the preventive maintenance to be done. But can I ask was all of components placed twisted or just some when machine was run at full tact time 0.12s, I ask this as I run a 4791 and if its only so

Soldermask Defined BGA Pads

Electronics Forum | Wed Oct 20 07:09:12 EDT 2004 | mattkehoe

Not really. Our process is a solid solder deposition application so we are not placing components into the wet paste prior to reflow. We print the paste then reflow is without components, trying to create a meniscus which is then washed, flattened,

Component Package/Classification

Electronics Forum | Thu Apr 21 17:46:17 EDT 2005 | Frank

Russ, Your math is right, but you are converting the wrong direction. I belive: 0201s use millimeters for specification sizes, not inches. And 01005 use millimeters for specification sizes, not inches. And it may be like that for all passives, bu

Poor soldering on fine pitch?

Electronics Forum | Tue Jun 13 17:16:44 EDT 2006 | slthomas

"I believe I was the one who stated in an old post that prying the leads is rediculous." I have been down this road as well. The prez of my previous employer decided that because he could pry .012" leads off the pads with a screwdriver that we had a


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