Electronics Forum | Thu Jan 02 10:35:19 EST 2014 | sims
Hello to everyone, I am running an old emerald p&p machine, which very often generates two errors L018 and L212 and I am always forced to restart the machine. Does anyone knows what these errors means and how to solve the problem?
Electronics Forum | Wed Sep 25 07:53:10 EDT 2002 | zanolli
Send me a drawing or sketch and I may be able to reccomend a supplier. fax: 401-781-5730 phone: 401-785-4110
Electronics Forum | Tue Oct 08 19:02:03 EDT 2002 | mjabure
Have you checked out autosplice? their URL is http://www.autosplice.com. They may be able to help you out.
Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef
IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"
Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare
0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare
Electronics Forum | Wed May 03 13:06:54 EDT 2000 | Sal
GUYS SEEING A PROBLEM WITH SOLDER PASTE LEACHING. THE PCB IS HASL FINISH , AND THE DEVICE IN QUESTION IS A O.O30" PITCH RESNET. THE SIZE OF THE PADS ARE 0.020 x 0.0.047 THOU , THE APERTURE SIZES ARE 0.018 x 0.042 THOU . THE LEACHING IS OCCURING DUE
Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef
Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Mon Sep 14 08:10:34 EDT 2015 | iamera
Hello Our production face a problem where our board after etching become shrinkage till 0.09mm but sometime it can be till 0.18mm. this happen after etching still the beginning of process not count for silver through hole and carbon process where th
Electronics Forum | Mon Jul 01 16:00:43 EDT 2024 | cyber_wolf
"When I need more heat for larger thermal mass, I no longer have to worry about balancing slower belt speed with higher temperature." Robin, so you have a method to use the same heater set points and belt speeds used on a .018" flex board and for 1/
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