Electronics Forum | Thu Jun 21 16:24:24 EDT 2001 | jdtpfacreate
OEM Boy, Reflow depends on your paste type also. Are you using lead free or will you be going to lead free soon? If your are going to you might want to consider developing two different profiles for lead free and leaded pastes. Good Luck! J.D.
Electronics Forum | Thu Jun 21 16:27:06 EDT 2001 | jdtpfacreate
OEM Boy, Reflow depends on your paste type also. Are you using lead free or will you be going to lead free soon? If your are going to you might want to consider developing two different profiles for lead free and leaded pastes. Good Luck! J.D.
Electronics Forum | Thu Jun 14 23:21:30 EDT 2001 | oem boy
I am working on 0201 development for my company in the UK, and I am planning a rather extensive DOE for my reflow oven profile. I am planning on studying various ramp rates, soak times, times above liquidus, peak temps, etc... My biggest concern
Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew
I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s
Electronics Forum | Tue Dec 03 20:54:57 EST 2002 | davef
Q1:A picture of the sectioned MLCC would be nice. A1: I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. R1: You�re correct. You cannot post pix on SMTnet. Please email me t
Electronics Forum | Mon Dec 02 21:32:34 EST 2002 | davef
Sounds like you're killing the poor little critters. Tell us about: * Placement force. * Reflow method. * Where and how you are measuring your reflow recipe. * Cooling rate of the reflow recipe. * How the solder connection to the metalization appear
Electronics Forum | Tue Sep 14 19:19:23 EDT 2021 | dwl
Just for grins, try rotating the board 180 degrees before reflow. this might allow both sides of the part to reflow at the same time. Is it just that one part with the arrow? Its interesting that none of the other parts have the same issue despite a
Electronics Forum | Fri Sep 10 15:15:09 EDT 2021 | majdi4
Hello to all , Could you help with this defect .. Tombstoning 0201 , always at the same place in board , only this component near to the coax connector..with a defect rate of 2 % ..All the process is perfect . i cheked : stencil design , SPI resul
Electronics Forum | Mon Dec 02 16:25:06 EST 2002 | jimlew
In doing process qualifications for 0201 caps, has anyone taken cross-sections and discovered cracks / hairline fractures / voids between the metalization on the end and the ceramic itself? (not cracks in the solder joint) We are well within the cap
Electronics Forum | Wed Dec 04 21:39:53 EST 2002 | davef
As you say, some BIG time force has pulled the metalization from the bottom of the component termination. From the pix it's hard to say whether it was caused by either: * Mechanical flexure of the board during an unusual heating or other processing
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