Electronics Forum | Wed Feb 23 22:03:23 EST 2000 | Todd Woods
Thin Film Technologies in Mankato Minnesota offers 0201 resistors. You can also talk to the people at KME as they supplied us the samples we needed to tst out the equipment.
Electronics Forum | Thu Feb 24 20:47:27 EST 2000 | Todd Woods
The camera is important. I found the only machine, granted this was a year ago, capable enough for volume production, was the KME CM-88. Our test had 1 mispicked device of 5,000,000 attemps and 0 misplacements.
Electronics Forum | Mon Sep 17 10:11:26 EDT 2001 | jstarkweather
What is the tightest spacing that you have assembled 0201 components? Under what assembly scenarios did you produce the best/worst yield at this spacing?
Electronics Forum | Thu Sep 20 17:24:29 EDT 2001 | steveb
Have you seen any solder beading (balling) with the aperture sizes you have been using on 0201 components? Have you experimented with some of the solder bead reducing designs?
Electronics Forum | Mon Nov 12 19:44:53 EST 2001 | ianchan
Am abit confused here, so suggestion is not to manual rework solder the 0201, and rather to cut em' out, with the cut shear applied at the end-terminals? elaborate pls? thanks
Electronics Forum | Tue Nov 13 11:50:56 EST 2001 | mparker
Maybe Prof. Whoopee will have to take out the 3 D BB and draw us a picture.
Electronics Forum | Thu May 30 14:22:58 EDT 2002 | Ozzy
For 0201 placement Siemens can also use the fiducial camera to locate the actual tape pocket and use it as the fiducial. First time pick rate is greater than 99.9% for 0201 components.
Electronics Forum | Mon May 19 19:32:50 EDT 2003 | Dave
Hello. We have a low profile LCC on a board. The clearance is ~ 2mils after reflow. Cleaning away residual flux with an ultrasonic 50C water cleaner caused some LCC and 0201 components to loosen. Should we stay away from the ultrasonic cleaner?
Electronics Forum | Wed Nov 10 02:13:32 EST 2004 | Grant
Hi, We are thinking about starting to use via in Pad, for both BGA and 0402 and 0201 components. Does anyone know how this would effect production. Obviously PCB production is not difficult, but this should only effect production and assembly. R
Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ
So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.
